WorldCat Identities

Worobey, Walter

Overview
Works: 3 works in 3 publications in 1 language and 3 library holdings
Publication Timeline
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Most widely held works by Walter Worobey
From display and PWB to MCMs: large panel manufacturing by D. W Palmer( Book )

1 edition published in 1994 in English and held by 1 WorldCat member library worldwide

Considerable manufacturing development is currently aimed at reducing high density Multichip Module (MCM) cost through the use of large panels (>40 cm [times] 40 cm) to fabricate many interconnection substrates in parallel. This drive for low cost MCM manufacturing is aided by the growing base of similar panel technology for the Printed Wiring Board (PWB) and Flat Panel display industries. It is toward this experience that the infant large panel MCM efforts are looking. In particular, the MCM Consortium formed by the Electronic Industry Association (EIA) and funded under the federal TRP effort is charged with developing a line of equipment optimized for large panel, fine line manufacture. PWB line definition research into large panels of glass and smooth non-woven laminate at 2-4 mil lines and spaces reveals that present equipment and processes are extendible well beyond commercial PWB product. In contrast, the ultra-cleanliness and spin coating of the silicon integrated circuit technology prove too expensive when scaled from 150mm diameter wafers to 560mm panels. Thus low waste photoresist (and other polymer dielectrics) application methods are needed for large panel manufacture. Similarly, PWB contact photomasking is nearing limits at 2-4 mil feature size, and projection or maskless direct write processes may be needed. Even small hand-held flat panel displays are manufactured from large panels to reduce the cost per display for conductive and dielectric layer deposition and patterning. In addition, as low cost flat displays become larger and improve in resolution, the line pitch and density approach that needed in high density MCMs
Flat panel display development activities at Sandia National Laboratories( Book )

1 edition published in 1994 in English and held by 1 WorldCat member library worldwide

The flat panel display development activities underway at Sandia National Laboratories are described. Research is being conducted in the areas of glass substrates, phosphors, large area processes, and electron emissions. Projects are focused on improving process yield, developing large area processes, and using modeling techniques to predict design performance
Diamond: A new high thermal conductivity substrate for multichip modules and hybrid circuits by David Norwood( Book )

1 edition published in 1992 in English and held by 1 WorldCat member library worldwide

An application for hybrid circuits and multichip modules create demand for higher density circuits and higher power components, new substrate materials are required to deal with the heat generated on the circuit. Sandia is developing diamond substrate technology to meet the requirements of high thermal conductivity. Thin film processes were developed and characterized to delineate conductor-resistor networks on free standing diamond substrates having fine line gold conductors and low and high sheet resistivity resistors. Thin film hybrid circuit technology was developed on CVD-processed, plycrystalline diamond substrates having as-deposited surface finishes as well as those with polished surfaces. Conductors were defined by pattern plating gold and resistors were processed from sputtered tantalum nitride films which were deposited to sheet resistivities of 5 and/or 100 ohms per square.
 
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Audience level: 0.61 (from 0.48 for From displ ... to 0.84 for Diamond: A ...)

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