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Microelectronics packaging handbook. Part 3, Subsystem packaging.
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Microelectronics packaging handbook. Part 3, Subsystem packaging.

Author: Rao R Tummala; Eugene J Rymaszewski; Alan G Klopfenstein
Publisher: New York : London : Chapman & Hall, ©1997.
Edition/Format: Book : English : 2nd ed.
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Document Type: Book
All Authors / Contributors: Rao R Tummala; Eugene J Rymaszewski; Alan G Klopfenstein
ISBN: 0412084511 9780412084515 0412084619 9780412084614
OCLC Number: 59657167
Notes: Previous ed.: New York : Van Nostrand Reinhold, 1989.
Description: xxix, 628 p. : ill. ; 24 cm.

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