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  E-mail Message: I thought you might be interested in this item at http://www.worldcat.org/oclc/59657167 Title: Microelectronics packaging handbook. Part 3, Subsystem packaging. Author: Rao R Tummala; Eugene J Rymaszewski; Alan G Klopfenstein Publisher: New York : London : Chapman & Hall, ©1997. ISBN/ISSN: 0412084511 9780412084515 0412084619 9780412084614 OCLC:59657167

  
  

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• Microelectronic packaging.

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Microelectronics packaging handbook. Part 3, Subsystem packaging.