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175 high-impact cover letters

Author: Richard H Beatty
Publisher: New York : J. Wiley and Sons, ©2002.
Edition/Format:   Print book : English : 3rd edView all editions and formats
Database:WorldCat
Summary:
"175 High-Impact Cover Letters, Third Edition arms job seekers with an arsenal of highly effective professional cover letter models that, with minor modification, can be rapidly deployed to each of five different types of cover letters: employer broadcast letters, search firm broadcast letters, advertising response letters, networking cover letters, and resume letters."
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Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: Richard H Beatty
ISBN: 0471219983 9780471219989 0471210846 9780471210849
OCLC Number: 48221375
Notes: Includes index.
Description: ix, 244 pages ; 28 cm
Contents: 1. Importance of cover letters --
2. Letters to employers --
3. Letters to search firms --
4. Advertising response cover letters --
5. Networking cover letters --
6. The resume letter --
7. Thank-you letters --
8. Cover letter "do's" and "don'ts."
Other Titles: One hundred seventy-five high-impact cover letters
Responsibility: Richard H. Beatty.
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Abstract:

"175 High-Impact Cover Letters, Third Edition arms job seekers with an arsenal of highly effective professional cover letter models that, with minor modification, can be rapidly deployed to each of five different types of cover letters: employer broadcast letters, search firm broadcast letters, advertising response letters, networking cover letters, and resume letters."

"With step-by-step instructions and a wealth of samples, 175 High-Impact Cover Letters shows you how to prepare a well-written, professional letter that will help you land the interview every time. For the Third Edition, almost every letter has been substantially rewritten or fine-tuned to reflect the current thinking and terminology in the field of staffing, while an entirely new chapter provides proven "do's" and "don'ts" of effective cover letter writing."--Jacket.

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