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1994 proceedings : Sixth Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA

Author: R M Lea; Stuart K Tewksbury; IEEE Computer Society.; Components, Packaging & Manufacturing Technology Society.
Publisher: [New York, N.Y.] : Institute of Electrical and Electronics Engineers ; Piscataway, NJ : Additional copies from IEEE Service Center, ©1994.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
Database:WorldCat
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Online version:
International Conference on Wafer Scale Integration (6th : 1994 : San Francisco, Calif.).
1994 proceedings.
[New York, N.Y.] : Institute of Electrical and Electronics Engineers ; Piscataway, NJ : Additional copies from IEEE Service Center, ©1994
(OCoLC)762169880
Material Type: Conference publication, Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: R M Lea; Stuart K Tewksbury; IEEE Computer Society.; Components, Packaging & Manufacturing Technology Society.
ISBN: 0780318501 9780780318502 0780318498 9780780318496 078031851X 9780780318519
OCLC Number: 30449210
Notes: "IEEE Catalog Number 94CH3412-4"--Title page verso.
Description: ix, 404 pages : illustrations ; 23 cm
Other Titles: Wafer Scale Integration, 1994, Proceedings, Sixth Annual IEEE International Conference on.
1994 IEEE International Conference on Wafer Scale Integration
Sixth Annual IEEE International Conference on Wafer Scale Integration
Wafer scale integration
Responsibility: sponsored by IEEE Computer Society, IEEE Components, Packaging & Manufacturing Technology Society ; edited by R. Mike Lea and Stuart Tewksbury.

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