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2013 Eurpoean Microelectronics Packaging Conference (EMPC).

Publisher: [S.l.] : IEEE, 2013.
Edition/Format:   eBook : Document
Summary:
Annotation

The program will focus on industrial needs and trends and on academic longer term solutions This event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

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Details

Genre/Form: Electronic books
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
ISBN: 9781509044665 1509044663
OCLC Number: 972634718
Notes: Title from content provider.
Description: 1 online resource.

Abstract:

Annotation

The program will focus on industrial needs and trends and on academic longer term solutions This event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

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Primary Entity

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