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3D integration for VLSI systems

Author: Chuan Seng Tan; Kuan-Neng Chen; Steven J Koester
Publisher: Singapore : Pan Stanford Pub., ©2012.
Edition/Format:   Print book : EnglishView all editions and formats
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Document Type: Book
All Authors / Contributors: Chuan Seng Tan; Kuan-Neng Chen; Steven J Koester
ISBN: 9789814303811 981430381X
OCLC Number: 772288627
Description: viii, 369 pages : color illustrations ; 24 cm
Contents: 3D integration technology : introduction and overview / Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester --
A systems perspective on 3D integration : what is 3D? And what is 3D good for? / Phil Emma, Eren Kursun --
Wafer bonding techniques / Bioh Kim ... [et al.] --
TSV etching / Paul Webaneth --
TSV filling / Arthur Keigler --
3D technology platform : temporary bonding and release / Mark Privett --
3D technology platform : wafer thinning, stress relief, and thin wafer handling / Scott Sullivan --
Advanced die-to-wafer 3D integration platform : self-assembly technology / Takafumi Fukushima ... [et al.] --
Advanced direct bond technology / Paul Enquist --
Surface modification bonding at low temperature for three-dimensional hetero-integration / Akitsu Shigetou --
Through silicon via imlementation in CMOS image sensor product / Xavier Gagnard, Nicolas Hotellier --
A 300-mm wafer-level three-dimensional integration scheme using Tungsten through-silicon via and hybrid cu-adhesive bonding / Fei Liu --
Power delivery in 3D IC technology with a stratum having an array of monolithic DC-DC point-of-load (PoL) converter cells / Ron Rutman, Jian Sun --
Thermal-aware 3D IC designs / Xiaoxia Wu, Yuan Xie, Vijaykirshnan Narayanan --
3D IC design automation considering dynamic power and thermal integrity / Hao Yu, Xiwei Huang --
Outlook / Ya Lan Yang.
Other Titles: Three-dimensional integration for very-large-scale integration systems
Responsibility: edited by Chuan Seng Tan, Kuan-Neng Chen, Steven J . Koester.

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"3D integration is expected to deliver performance improvement and functional enhancement in future integrated circuits and systems. This book covers a wide range of 3D integration topics authored by Read more...

 
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