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3D integration in VLSI circuits : implementation technologies and applications

Author: Katsuyuki Sakuma
Publisher: Boca Raton, FL : CRC Press/Taylor & Francis Group, 2018.
Series: Devices, circuits, & systems
Edition/Format:   eBook : Document : EnglishView all editions and formats
Summary:
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only  Read more...
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Genre/Form: Electronic books
Additional Physical Format: Print version:
3D integration in VLSI circuits.
Boca Raton, FL : CRC Press/Taylor & Francis Group, 2018
(DLC) 2018010530
(OCoLC)1029794729
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Katsuyuki Sakuma
ISBN: 9781315200699 1315200694 9781351779838 1351779834 9781351779814 1351779818
OCLC Number: 1032611958
Description: 1 online resource.
Contents: 3D Integration: Technology and Design / P. Franzon --
3D SiP for ASIC and 3D DRAM Integration / L. Li --
A New Class of High-capacity, Resource-rich FPGAs Enabled by 3D-IC Stacked Silicon Interconnect Technology (SSIT) / S. Ramalingam, Henley Liu, Myongseob Kim, Boon Ang, Woon-Seong Kwon, Tom Lee, Susan Wu, Jonathan Chang, Ephrem Wu, Xin Wu, and Liam Madden --
Challenges in 3D / M. Koyanagi, T. Fukushima, and T. Tanaka --
Wafer-Level Three-Dimensional Integration (3DI) using Bumpless Interconnects and Ultra-Thinning / T. Ohba --
3DI stacking technologies for high volume manufacturing by use of wafer level oxide bonding integration / S. Skordas, K. Sakuma, K. Winstel, and C. Kothandaraman --
Toward 3D high density / S. Cheramy, A. Jouve, C. Fenouillet-Beranger, P. Vivet, and L. Di Cioccio --
Novel Platforms and Applications Using 3D and Heterogeneous Integration Technologies / K-N. Chen, Ting-Yang Yu, Yu-Chen Hu, Cheng-Hsien Lu.
Series Title: Devices, circuits, & systems
Responsibility: [edited by] Katsuyuki Sakuma.

Abstract:

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe--

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"With the increasing cost and power issues associated with continuing along the traditional road of 2D scaling, 3D integration is becoming an essential enabler for performance gains in future VLSI Read more...

 
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Primary Entity

<http://www.worldcat.org/oclc/1032611958> # 3D integration in VLSI circuits : implementation technologies and applications
    a schema:Book, schema:CreativeWork, schema:MediaObject ;
    library:oclcnum "1032611958" ;
    library:placeOfPublication <http://id.loc.gov/vocabulary/countries/flu> ;
    schema:about <http://experiment.worldcat.org/entity/work/data/4846093491#Topic/three_dimensional_integrated_circuits> ; # Three-dimensional integrated circuits
    schema:about <http://experiment.worldcat.org/entity/work/data/4846093491#Topic/electronics> ; # Electronics
    schema:about <http://experiment.worldcat.org/entity/work/data/4846093491#Topic/technology_&_engineering_mechanical> ; # TECHNOLOGY & ENGINEERING / Mechanical
    schema:about <http://dewey.info/class/621.395/e23/> ;
    schema:about <http://experiment.worldcat.org/entity/work/data/4846093491#Topic/integrated_circuits_very_large_scale_integration> ; # Integrated circuits--Very large scale integration
    schema:about <http://experiment.worldcat.org/entity/work/data/4846093491#Topic/computer_engineering> ; # Computer engineering
    schema:author <http://experiment.worldcat.org/entity/work/data/4846093491#Person/sakuma_katsuyuki> ; # Katsuyuki Sakuma
    schema:bookFormat schema:EBook ;
    schema:datePublished "2018" ;
    schema:description "Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe--"@en ;
    schema:description "3D Integration: Technology and Design / P. Franzon -- 3D SiP for ASIC and 3D DRAM Integration / L. Li -- A New Class of High-capacity, Resource-rich FPGAs Enabled by 3D-IC Stacked Silicon Interconnect Technology (SSIT) / S. Ramalingam, Henley Liu, Myongseob Kim, Boon Ang, Woon-Seong Kwon, Tom Lee, Susan Wu, Jonathan Chang, Ephrem Wu, Xin Wu, and Liam Madden -- Challenges in 3D / M. Koyanagi, T. Fukushima, and T. Tanaka -- Wafer-Level Three-Dimensional Integration (3DI) using Bumpless Interconnects and Ultra-Thinning / T. Ohba -- 3DI stacking technologies for high volume manufacturing by use of wafer level oxide bonding integration / S. Skordas, K. Sakuma, K. Winstel, and C. Kothandaraman -- Toward 3D high density / S. Cheramy, A. Jouve, C. Fenouillet-Beranger, P. Vivet, and L. Di Cioccio -- Novel Platforms and Applications Using 3D and Heterogeneous Integration Technologies / K-N. Chen, Ting-Yang Yu, Yu-Chen Hu, Cheng-Hsien Lu."@en ;
    schema:exampleOfWork <http://worldcat.org/entity/work/id/4846093491> ;
    schema:genre "Electronic books"@en ;
    schema:inLanguage "en" ;
    schema:isPartOf <http://experiment.worldcat.org/entity/work/data/4846093491#Series/devices_circuits_&_systems> ; # Devices, circuits, & systems
    schema:isSimilarTo <http://www.worldcat.org/oclc/1029794729> ;
    schema:name "3D integration in VLSI circuits : implementation technologies and applications"@en ;
    schema:productID "1032611958" ;
    schema:url <https://www.taylorfrancis.com/books/9781351779838> ;
    schema:url <http://ebookcentral.proquest.com/lib/cornell/detail.action?docID=5352257> ;
    schema:url <https://0-www-taylorfrancis-com.pugwash.lib.warwick.ac.uk/books/9781351779838> ;
    schema:url <http://public.eblib.com/choice/PublicFullRecord.aspx?p=5352257> ;
    schema:url <http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=1769144> ;
    schema:url <https://ebookcentral.proquest.com/lib/macewan-ebooks/detail.action?docID=5352257> ;
    schema:workExample <http://worldcat.org/isbn/9781351779838> ;
    schema:workExample <http://worldcat.org/isbn/9781315200699> ;
    schema:workExample <http://worldcat.org/isbn/9781351779814> ;
    wdrs:describedby <http://www.worldcat.org/title/-/oclc/1032611958> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/4846093491#Person/sakuma_katsuyuki> # Katsuyuki Sakuma
    a schema:Person ;
    schema:familyName "Sakuma" ;
    schema:givenName "Katsuyuki" ;
    schema:name "Katsuyuki Sakuma" ;
    .

<http://experiment.worldcat.org/entity/work/data/4846093491#Series/devices_circuits_&_systems> # Devices, circuits, & systems
    a bgn:PublicationSeries ;
    schema:hasPart <http://www.worldcat.org/oclc/1032611958> ; # 3D integration in VLSI circuits : implementation technologies and applications
    schema:name "Devices, circuits, & systems" ;
    .

<http://experiment.worldcat.org/entity/work/data/4846093491#Topic/computer_engineering> # Computer engineering
    a schema:Intangible ;
    schema:name "Computer engineering"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/4846093491#Topic/integrated_circuits_very_large_scale_integration> # Integrated circuits--Very large scale integration
    a schema:Intangible ;
    schema:name "Integrated circuits--Very large scale integration"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/4846093491#Topic/technology_&_engineering_mechanical> # TECHNOLOGY & ENGINEERING / Mechanical
    a schema:Intangible ;
    schema:name "TECHNOLOGY & ENGINEERING / Mechanical"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/4846093491#Topic/three_dimensional_integrated_circuits> # Three-dimensional integrated circuits
    a schema:Intangible ;
    schema:name "Three-dimensional integrated circuits"@en ;
    .

<http://worldcat.org/isbn/9781315200699>
    a schema:ProductModel ;
    schema:isbn "1315200694" ;
    schema:isbn "9781315200699" ;
    .

<http://worldcat.org/isbn/9781351779814>
    a schema:ProductModel ;
    schema:isbn "1351779818" ;
    schema:isbn "9781351779814" ;
    .

<http://worldcat.org/isbn/9781351779838>
    a schema:ProductModel ;
    schema:isbn "1351779834" ;
    schema:isbn "9781351779838" ;
    .

<http://www.worldcat.org/oclc/1029794729>
    a schema:CreativeWork ;
    rdfs:label "3D integration in VLSI circuits." ;
    schema:description "Print version:" ;
    schema:isSimilarTo <http://www.worldcat.org/oclc/1032611958> ; # 3D integration in VLSI circuits : implementation technologies and applications
    .

<http://www.worldcat.org/title/-/oclc/1032611958>
    a genont:InformationResource, genont:ContentTypeGenericResource ;
    schema:about <http://www.worldcat.org/oclc/1032611958> ; # 3D integration in VLSI circuits : implementation technologies and applications
    schema:dateModified "2018-08-21" ;
    void:inDataset <http://purl.oclc.org/dataset/WorldCat> ;
    .

<https://0-www-taylorfrancis-com.pugwash.lib.warwick.ac.uk/books/9781351779838>
    rdfs:comment "Connect to Taylor and Francis e-book" ;
    .

<https://ebookcentral.proquest.com/lib/macewan-ebooks/detail.action?docID=5352257>
    rdfs:comment "from Ebook Central" ;
    rdfs:comment "(Single User Access)" ;
    .

<https://www.taylorfrancis.com/books/9781351779838>
    rdfs:comment "Distributed by publisher. Purchase or institutional license may be required for access." ;
    .


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