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Adhesion of polymers to tungsten as studied by field ion microscopy

Author: William A Brainard; Donald H Buckley; United States. National Aeronautics and Space Administration.; Lewis Research Center.
Publisher: Washington, D.C. : National Aeronautics and Space Administration ; [Springfield, Va.] : [For sale by the National Technical Information Service], 1971.
Series: NASA technical note, D-6524.
Edition/Format:   eBook : Document : National government publication : EnglishView all editions and formats
Summary:
Mechanical contacts with polytetrafluoroethylene (PTFE) and polyimide polymer (PI) contacting tungsten field ion microscope emitter tips were conducted in vacuum. The metal polymer interface was examined on an atomic scale by helium field ion microscopy. Mechanical transfer was observed upon simple touch contact of the polymer materials to tungsten. The transferred polymers were stable even at the high field  Read more...
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Additional Physical Format: Online version:
Brainard, William A.
Adhesion of polymers to tungsten as studied by field ion microscopy.
Washington, D.C. : National Aeronautics and Space Administration ; [Springfield, Va. : For sale by the National Technical Information Service], 1971
(OCoLC)761381697
Material Type: Document, Government publication, National government publication, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: William A Brainard; Donald H Buckley; United States. National Aeronautics and Space Administration.; Lewis Research Center.
OCLC Number: 20698024
Notes: Cover title.
Research prepared at Lewis Research Center.
Description: 1 online resource (31 pages) : illustrations.
Series Title: NASA technical note, D-6524.
Responsibility: by William A. Brainard and Donald H. Buckley.

Abstract:

Mechanical contacts with polytetrafluoroethylene (PTFE) and polyimide polymer (PI) contacting tungsten field ion microscope emitter tips were conducted in vacuum. The metal polymer interface was examined on an atomic scale by helium field ion microscopy. Mechanical transfer was observed upon simple touch contact of the polymer materials to tungsten. The transferred polymers were stable even at the high field necessary for helium ionization, thus implying a strong chemical bonding to the metal surface. The mechanical contact stresses orient the transferred material on the tungsten surface in a radial manner from the center of contact. With sufficient load the PTFE and PI cause deformation of the tungsten. On the tungsten (110) plane, individual molecular clusters can be resolved.

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