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Adhesion promotion techniques : technological applications

Author: K L Mittal; A Pizzi
Publisher: New York : M. Dekker, ©1999.
Series: Materials engineering (Marcel Dekker, Inc.), 14.
Edition/Format:   Print book : EnglishView all editions and formats
Database:WorldCat
Summary:

Presents the developments in improving bond strength between different materials for many manufacturing processes. This text explores adhesion technologies for a variety of materials, explaining the  Read more...

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Document Type: Book
All Authors / Contributors: K L Mittal; A Pizzi
ISBN: 0824702395 9780824702397
OCLC Number: 40595371
Description: ix, 404 p. : ill. ; 24 cm.
Contents: Theories and mechanisms of adhesion / J. Schultz and M. Nardin --
Harnessing acid-base interactions to improve adhesion / Mohamed Mehdi Chehimi --
Molecular mechanics-dynamics modeling and adhesion / A. Pizzi --
Application of atomic force microscopy in fundamental adhesion studies / Robert A. Hayes and John Ralston --
Plasma treatment of polymers to improve adhesion / Michael R. Wertheimer [and others] --
Flame treatment of polymers to improve adhesion / Derek McHardy Brewis and Isla Mathieson --
Corona discharge treatment of polymers / Tohru Uehara --
Laser surface treatment to improve adhesion / Alisa Buchman and Hanna Dodiuk-Kenig --
Adhesion enhancement of metallic films to ceramic substrates using UV lasers and low-energy ions / A.J. Pedraza --
Surface graft copolymerization and grafting of polymers for adhesion improvement / E.T. Kang [and others] --
Microbial treatment of polymer surfaces to improve adhesion / Elena V. Pisanova --
Silanes on glass fibers--adhesion promoters for composite applications / Leanne Britcher, Scott Kempson, and Janis Matisons.
Series Title: Materials engineering (Marcel Dekker, Inc.), 14.
Responsibility: edited by K.L. Mittal, A. Pizzi.
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"This excellent book, offered by noted adhesion expert and book editor Kash Mittal and Professor A. Pizzi, comprehensively covers adhesion promotion by plasma, flame, corona, laser, less energetic Read more...

 
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