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Adhesive Chemistry : Developments and Trends

Author: Lieng-Huang Lee
Publisher: Boston, MA : Springer US, 1985.
Series: Polymer science and technology, 29.
Edition/Format:   eBook : Bibliographic data : EnglishView all editions and formats
Summary:
Since the first symposium on Recent Advances in Adhesion, held September, 1971 in Washington, D.C., this Division of the American Chemical Society has continuously sponsored several symposia on adhesion and adhesives. The chemists have gradually realized the importance of adhesion in various fields of science and technology. During these years, the science of adhesion has steadily grown along with progress in  Read more...
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Genre/Form: Electronic books
Additional Physical Format: Printed edition:
Material Type: Bibliographic data, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Lieng-Huang Lee
ISBN: 9781461324355 1461324351 9781461294818 1461294819
OCLC Number: 840281685
Description: 1 online resource (871 pages).
Contents: One: Chemistry of Adhesion --
The Importance of Interface --
Introductory Remarks --
Recent Developments in Adhesive and Sealant Chemistry --
Overview of Adherence Phenomena --
An Analytical Method for Determining the Surface Energy of Solid Polymers --
Effect of Amine Surface Treatment on the Adhesion of Polyurethane to the Surface --
Effect of Silane on Glass/Resin Adhesion Strength --
Discussion --
Two: Physics of Adhesion --
Characterization of Surface and Bulk of Adhesive Systems --
Introductory Remarks --
New Applications of ESCA --
Fracto-Emission Accompanying Adhesive Failure --
Monitoring Epoxy Cure Kinetics with a Viscosity-Dependent Fluorescent Probe --
Dynamic Mechanical Properties of Silicone Pressure Sensitive Adhesives --
The Viscoelastic Properties of Pressure-Sensitive Adhesives --
Block Copolymer Adhesive Studies --
Discussion --
Three: Radiation-Curable Adhesives --
Introductory Remarks --
Ultraviolet Cured Pressure-Sensitive Adhesives --
Recent Progress in Photoinitiated Cationic Polymerization --
Polymer and Formulation Design Characteristics for Developing Bonding Capabilities of Radiation-Curable Coatings and Adhesive Systems --
Dynamic Thermal Analysis Characterizations of Electron-Beam Cured Adhesives --
Reactive Butadiene/Acrylonitrile Liquid and Solid Elastomers: Formulating Acrylic, Anaerobic, and Radiation-Curable Adhesives --
Photoinitiators: A Review of Mechanisms and Applications --
Discussion --
Four: High Temperature Adhesives --
Introductory Remarks --
Status of High Temperature Adhesives --
Polyimide Adhesives: Modified with ATBN and Silicone Elastomers --
The Application of Thermodynamic and Spectroscopic Techniques to Adhesion in the Polyimide/Ti 6-4 and Polyphenyl-quinoxaline/Ti 6-4 Systems --
Evaluation of High Temperature Structural Adhesives for Extended Service --
Aminosilane and Metal Modifications of Polyimide Surfaces --
Influence of Molecular Weight on Fracture Behavior of Polyphenylquinoxaline Thermosets --
Discussion --
Five: Anaerobic and Structural Adhesives --
Introductory Remarks --
Some Recent Developments in Scanning Electron Microscopy --
Potential Anaerobic and Structural Acrylic Modified Polyester Adhesives --
Anaerobic Adhesives Containing Maleimides Having Improved Thermal Resistance --
Chemistry of Accelerators for Curing Anaerobic Adhesives --
Reaction of N, N-Dimethylaniline Derivatives with Cumene Hydroperoxide --
Chemistry, Physical Properties and Durability of Structural Adhesive Bonds --
Reactive Butadiene/Acrylonitrile Liquid and Solid Elastomers: A Bibliography for Formulating Epoxy Structured Adhesives --
A Low Curing Temperature CTBN-Toughened Epoxy Adhesive --
Summarizing Remarks --
Discussion --
Six: Trends in Adhesive Research --
Developments in and Limitations of Adhesive Materials for Severe Environments and a Long Service Life --
Elastomers and Resin Modifiers for Water-Base Adhesives --
'Aerobic' Acrylic Adhesives- New Technology in Acrylic Adhesives --
Radiant Energy Curable Adhesives --
Isocyanatoethyl Methacrylate: A Latent Cross linker for Coating Adhesive Resins --
Moisture Permeation of Polymer Sealants and Interface Modifying Films --
ESCA and AES Studies of the Interfacial Chemical Bonding between Aluminum and Chromium (III) Fumarato-Coordination Compound --
Adhesive Research in China --
Discussion --
Contributors --
Author Index.
Series Title: Polymer science and technology, 29.
Other Titles: Proceedings of a Symposium on Recent Developments in Adhesive Chemistry, sponsored by the Divsion of Organic Coatings and Plastics Chemistry of the American Chemical Society, held March 21-23, 1983, in Seattle, Washington
Responsibility: edited by Lieng-Huang Lee.

Abstract:

Proceedings of a Symposium on Recent Developments in Adhesive Chemistry, sponsored by the Divsion of Organic Coatings and Plastics Chemistry of the American Chemical Society, held March 21-23,  Read more...

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   schema:description "One: Chemistry of Adhesion -- The Importance of Interface -- Introductory Remarks -- Recent Developments in Adhesive and Sealant Chemistry -- Overview of Adherence Phenomena -- An Analytical Method for Determining the Surface Energy of Solid Polymers -- Effect of Amine Surface Treatment on the Adhesion of Polyurethane to the Surface -- Effect of Silane on Glass/Resin Adhesion Strength -- Discussion -- Two: Physics of Adhesion -- Characterization of Surface and Bulk of Adhesive Systems -- Introductory Remarks -- New Applications of ESCA -- Fracto-Emission Accompanying Adhesive Failure -- Monitoring Epoxy Cure Kinetics with a Viscosity-Dependent Fluorescent Probe -- Dynamic Mechanical Properties of Silicone Pressure Sensitive Adhesives -- The Viscoelastic Properties of Pressure-Sensitive Adhesives -- Block Copolymer Adhesive Studies -- Discussion -- Three: Radiation-Curable Adhesives -- Introductory Remarks -- Ultraviolet Cured Pressure-Sensitive Adhesives -- Recent Progress in Photoinitiated Cationic Polymerization -- Polymer and Formulation Design Characteristics for Developing Bonding Capabilities of Radiation-Curable Coatings and Adhesive Systems -- Dynamic Thermal Analysis Characterizations of Electron-Beam Cured Adhesives -- Reactive Butadiene/Acrylonitrile Liquid and Solid Elastomers: Formulating Acrylic, Anaerobic, and Radiation-Curable Adhesives -- Photoinitiators: A Review of Mechanisms and Applications -- Discussion -- Four: High Temperature Adhesives -- Introductory Remarks -- Status of High Temperature Adhesives -- Polyimide Adhesives: Modified with ATBN and Silicone Elastomers -- The Application of Thermodynamic and Spectroscopic Techniques to Adhesion in the Polyimide/Ti 6-4 and Polyphenyl-quinoxaline/Ti 6-4 Systems -- Evaluation of High Temperature Structural Adhesives for Extended Service -- Aminosilane and Metal Modifications of Polyimide Surfaces -- Influence of Molecular Weight on Fracture Behavior of Polyphenylquinoxaline Thermosets -- Discussion -- Five: Anaerobic and Structural Adhesives -- Introductory Remarks -- Some Recent Developments in Scanning Electron Microscopy -- Potential Anaerobic and Structural Acrylic Modified Polyester Adhesives -- Anaerobic Adhesives Containing Maleimides Having Improved Thermal Resistance -- Chemistry of Accelerators for Curing Anaerobic Adhesives -- Reaction of N, N-Dimethylaniline Derivatives with Cumene Hydroperoxide -- Chemistry, Physical Properties and Durability of Structural Adhesive Bonds -- Reactive Butadiene/Acrylonitrile Liquid and Solid Elastomers: A Bibliography for Formulating Epoxy Structured Adhesives -- A Low Curing Temperature CTBN-Toughened Epoxy Adhesive -- Summarizing Remarks -- Discussion -- Six: Trends in Adhesive Research -- Developments in and Limitations of Adhesive Materials for Severe Environments and a Long Service Life -- Elastomers and Resin Modifiers for Water-Base Adhesives -- 'Aerobic' Acrylic Adhesives- New Technology in Acrylic Adhesives -- Radiant Energy Curable Adhesives -- Isocyanatoethyl Methacrylate: A Latent Cross linker for Coating Adhesive Resins -- Moisture Permeation of Polymer Sealants and Interface Modifying Films -- ESCA and AES Studies of the Interfacial Chemical Bonding between Aluminum and Chromium (III) Fumarato-Coordination Compound -- Adhesive Research in China -- Discussion -- Contributors -- Author Index."@en ;
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