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Adhesives technology for electronic applications : materials, processing, reliability

Author: James J Licari; Dale W Swanson
Publisher: Amsterdam ; Boston : Elsevier, ©2011.
Series: Materials and processes for electronic applications series.
Edition/Format:   eBook : Document : English : 2nd edView all editions and formats
Summary:
Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are  Read more...
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Genre/Form: Electronic books
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: James J Licari; Dale W Swanson
ISBN: 9781437778892 1437778895
OCLC Number: 733936687
Description: 1 online resource (x, 403 pages).
Contents: Functions and Theory of Adhesives --
Chemistry, Formulation, and Properties of Adhesives --
Adhesive Bonding Properties --
Applications --
Reliability --
Test and Inspection Methods --
Appendix --
Conversion Factors.
Series Title: Materials and processes for electronic applications series.
Responsibility: James J. Licari and Dale W. Swanson.

Abstract:

Includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. This book is suitable for a range  Read more...

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"I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both." --George Riley

 
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