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  E-mail Message: I thought you might be interested in this item at http://www.worldcat.org/oclc/62089027 Title: Advanced electronic packaging. Author: Richard K Ulrich; William D Brown Publisher: Hoboken, NJ : [Chichester : Wiley-Interscience/IEEE ; John Wiley distributor], ©2006. ISBN/ISSN: 0471466093 9780471466093 OCLC:62089027

  
  

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Subjects

• Microelectronic packaging.
• Mise sous boîtier (Microélectronique)
• Mise sous boîtier (Électronique)

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Advanced electronic packaging.

Author:	Richard K Ulrich; William D Brown
Publisher:	Hoboken, NJ : Wiley-Interscience/IEEE ; [Chichester : John Wiley distributor], ©2006.
Series:	IEEE Press series on microelectronic systems.
Edition/Format:	Book : English : 2nd ed.View all editions and formats
Summary:	This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.  Read more...
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