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Advanced electronic packaging.

Author: Richard K Ulrich; William D Brown
Publisher: Hoboken, NJ : Wiley-Interscience/IEEE ; [Chichester] : [John Wiley distributor], ©2006.
Series: IEEE Press series on microelectronic systems.
Edition/Format:   book_printbook : English : 2nd ed.View all editions and formats
Database:WorldCat
Summary:
"As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All  Read more...
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Details

Document Type: Book
All Authors / Contributors: Richard K Ulrich; William D Brown
ISBN: 0471466093 9780471466093
OCLC Number: 62089027
Notes: Previous edition: / William D. Brown. New York: IEEE, 1999.
Description: xxvi, 812 pages : illustrations ; 26 cm.
Contents: Chapter 1: Introduction and overview of microelectronic packaging. --
Chapter 2: Materials for microelectronic packaging. --
Chapter 3: Processing technologies. --
Chapter 4: Organic printed circuit board materials and processes. --
Chapter 5: Ceramic substrates. --
Chapter 6: Electrical considerations, modeling, and simulation. --
Chapter 7: Thermal considerations. --
Chapter 8: Mechanical design considerations. --
Chapter 9: Discrete and embedded passive devices. --
Chapter 10: Electronic package assembly. --
Chapter 11: Design considerations. --
Chapter 12: Radio frequency and microwave packaging. --
Chapter 13: Power electronics packaging. --
Chapter 14: Multichip and three dimensional packaging. --
Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study. --
Chapter 16: Reliability considerations. --
Chapter 17: Cost evaluation and analysis. --
Chapter 18: Analytical techniques for materials characterization.
Series Title: IEEE Press series on microelectronic systems.
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Abstract:

This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by  Read more...

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"...a very nice reference." (IEEE Circuits & Devices Magazine, November/December 2006) "...offers a broad perspective on electronic packaging." (Advanced Packaging Online, August 11, 2006) "...an Read more...

 
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