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Advanced flip chip packaging

Author: Ho-ming Herbert Tong; Yi-Shao Lai; C P Wong
Publisher: New York ; London : Springer, 2013.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Database:WorldCat
Summary:
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are  Read more...
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Advanced flip chip packaging.
New York ; London : Springer, 2010
(OCoLC)489634784
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Ho-ming Herbert Tong; Yi-Shao Lai; C P Wong
ISBN: 9781441957689 1441957685
OCLC Number: 831414809
Description: 1 online resource.
Contents: Market Trends: Past, Present, and Future / Robert Lanzone --
Technology Trends: Past, Present, and Future / Eric Perfecto, Kamalesh Srivastava --
Bumping Technologies / Michael Töpper, Daniel Lu --
Flip-Chip Interconnections: Past, Present, and Future / Sung-Kwon Kang, Da-Yuan Shih, William E. Bernier --
Flip Chip Underfill: Materials, Process, and Reliability / Zhuqing Zhang, Shijian Luo, C. P. Wong --
Conductive Adhesives for Flip-Chip Applications / Daoqiang Daniel Lu, C. P. Wong --
Substrate Technology / Yutaka Tsukada --
IC-Package-System Integration Design / Yiyu Shi, Yang Shang, Hao Yu, Shauki Elassaad --
Thermal Management of Flip Chip Packages / Richard C. Chu, Robert E. Simons, Madhusudan Iyengar --
Thermo-mechanical Reliability in Flip-Chip Packages / Li Li, Hongtao Ma --
Interfacial Reactions and Electromigration in Flip-Chip Solder Joints / C. E. Ho, C. R. Kao, K. N. Tu.
Responsibility: edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong.

Abstract:

Flip chip packaging is used in computing, communications, consumer and automotive electronics. This book discusses past, present and future advances in flip chip packaging, covering trends in  Read more...

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