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Advanced thermal management materials

Author: Guosheng Jiang; Liyong Diao; Ken Kuang
Publisher: New York, NY : Springer, ©2013.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Database:WorldCat
Summary:
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage  Read more...
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Jiang, Guosheng.
Advanced thermal management materials.
New York : Springer, ©2013
(OCoLC)818786114
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Guosheng Jiang; Liyong Diao; Ken Kuang
ISBN: 9781461419631 1461419638
OCLC Number: 810933662
Description: 1 online resource (xi, 154 pages)
Contents: Introduction to Thermal Management in Microelectronics Packaging --
Requirements of Thermal Management Materials --
Overview of Traditional Thermal Management Materials --
Development of Advanced Thermal Management Materials --
Properties of WCu, MoCu, and Cu/MoCu/Cu High-performance Heat Sink Materials and Manufacturing Technologies --
Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications --
Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications --
AlSiC Thermal Management Materials --
Understanding Lasers, Laser Diodes, Laser Diode Packaging and Their Relationship to Tungsten Copper --
Future Trend of Advanced Thermal Management Materials.
Responsibility: Guosheng Jiang, Liyong Diao, Ken Kuang.
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Abstract:

This book offers a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. Covers all aspects of thermal management materials, both traditional and  Read more...

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