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Advanced wirebond interconnection technology

Author: Shankara K Prasad
Publisher: Boston : Kluwer Academic Publishers, 2004.
Edition/Format:   Print book : CD for computer : EnglishView all editions and formats
Database:WorldCat
Summary:

Addresses wire bonding from both manufacturing and reliability perspectives. This book explains how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how  Read more...

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Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: Shankara K Prasad
ISBN: 1402077629 9781402077623 1402077637 9781402077630
OCLC Number: 54372036
Description: xxviii, 668 pages : illustrations ; 24 cm + 1 CD-ROM (4 3/4 in.)
Contents: Materials for Wire Bonding.- Bonding Equipment.- Process Technology.- Quality.- Reliability.- New Technologies and New Applications for Wire Bonding.
Responsibility: by Shankara K. Prasad.
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From the reviews: "...intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers... This book has excellent Read more...

 
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