skip to content
Advances in electronic circuit packaging; proceedings. Preview this item
ClosePreview this item
Checking...

Advances in electronic circuit packaging; proceedings.

Author: Lawrence L Rosine; University of Colorado (Boulder campus)
Publisher: [Englewood, Colo.] Cahners Pub. Co.; distributed by Plenum Press, New York, 1965.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
Rating:

(not yet rated) 0 with reviews - Be the first.

Subjects
More like this

Find a copy in the library

&AllPage.SpinnerRetrieving; Finding libraries that hold this item...

Details

Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Lawrence L Rosine; University of Colorado (Boulder campus)
OCLC Number: 1164822
Notes: "Sponsored by the University of Colorado, EDN (Electrical design news), and Design news."
Description: vi, 297 pages illustrations 26 cm
Other Titles: Electrical design news.
Design news.
Responsibility: Edited by Lawrence L. Rosine.

Reviews

User-contributed reviews
Retrieving GoodReads reviews...
Retrieving DOGObooks reviews...

Tags

Be the first.
Confirm this request

You may have already requested this item. Please select Ok if you would like to proceed with this request anyway.

Linked Data


Primary Entity

<http://www.worldcat.org/oclc/1164822> # Advances in electronic circuit packaging; proceedings.
    a schema:Book, schema:CreativeWork ;
    library:oclcnum "1164822" ;
    library:placeOfPublication <http://id.loc.gov/vocabulary/countries/cou> ;
    library:placeOfPublication <http://experiment.worldcat.org/entity/work/data/2101573#Place/englewood_colo> ; # Englewood, Colo.
    rdfs:seeAlso <http://experiment.worldcat.org/entity/work/data/2101573#CreativeWork/electrical_design_news> ; # Electrical design news.
    rdfs:seeAlso <http://experiment.worldcat.org/entity/work/data/2101573#CreativeWork/design_news> ; # Design news.
    schema:about <http://id.worldcat.org/fast/907414> ; # Electronic packaging
    schema:about <http://experiment.worldcat.org/entity/work/data/2101573#Topic/encapsulation_electronique_congres> ; # Encapsulation (électronique)--Congrès
    schema:about <http://experiment.worldcat.org/entity/work/data/2101573#Topic/electronic_packaging> ; # Electronic packaging
    schema:about <http://experiment.worldcat.org/entity/work/data/2101573#Topic/mise_sous_boitier_electronique_congres> ; # Mise sous boîtier (électronique)--Congrès
    schema:bookFormat bgn:PrintBook ;
    schema:contributor <http://viaf.org/viaf/133657124> ; # University of Colorado (Boulder campus)
    schema:creator <http://experiment.worldcat.org/entity/work/data/2101573#Meeting/international_electronic_circuit_packaging_symposium_5th_1964_boulder_colo> ; # International Electronic Circuit Packaging Symposium (5th : 1964 : Boulder, Colo.)
    schema:datePublished "1965" ;
    schema:editor <http://experiment.worldcat.org/entity/work/data/2101573#Person/rosine_lawrence_l> ; # Lawrence L. Rosine
    schema:exampleOfWork <http://worldcat.org/entity/work/id/2101573> ;
    schema:genre "Conference papers and proceedings"@en ;
    schema:genre "Conference publication"@en ;
    schema:inLanguage "en" ;
    schema:name "Advances in electronic circuit packaging; proceedings."@en ;
    schema:productID "1164822" ;
    schema:publication <http://www.worldcat.org/title/-/oclc/1164822#PublicationEvent/englewood_colo_cahners_pub_co_distributed_by_plenum_press_new_york_1965> ;
    schema:publisher <http://experiment.worldcat.org/entity/work/data/2101573#Agent/cahners_pub_co_distributed_by_plenum_press_new_york> ; # Cahners Pub. Co.; distributed by Plenum Press, New York
    wdrs:describedby <http://www.worldcat.org/title/-/oclc/1164822> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/2101573#Agent/cahners_pub_co_distributed_by_plenum_press_new_york> # Cahners Pub. Co.; distributed by Plenum Press, New York
    a bgn:Agent ;
    schema:name "Cahners Pub. Co.; distributed by Plenum Press, New York" ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#CreativeWork/electrical_design_news> # Electrical design news.
    a schema:CreativeWork ;
    schema:name "Electrical design news." ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Meeting/international_electronic_circuit_packaging_symposium_5th_1964_boulder_colo> # International Electronic Circuit Packaging Symposium (5th : 1964 : Boulder, Colo.)
    a bgn:Meeting, schema:Event ;
    schema:location <http://experiment.worldcat.org/entity/work/data/2101573#Place/boulder_colo> ; # Boulder, Colo.)
    schema:name "International Electronic Circuit Packaging Symposium (5th : 1964 : Boulder, Colo.)" ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Person/rosine_lawrence_l> # Lawrence L. Rosine
    a schema:Person ;
    schema:familyName "Rosine" ;
    schema:givenName "Lawrence L." ;
    schema:name "Lawrence L. Rosine" ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Place/boulder_colo> # Boulder, Colo.)
    a schema:Place ;
    schema:name "Boulder, Colo.)" ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Place/englewood_colo> # Englewood, Colo.
    a schema:Place ;
    schema:name "Englewood, Colo." ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Topic/encapsulation_electronique_congres> # Encapsulation (électronique)--Congrès
    a schema:Intangible ;
    schema:name "Encapsulation (électronique)--Congrès"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/2101573#Topic/mise_sous_boitier_electronique_congres> # Mise sous boîtier (électronique)--Congrès
    a schema:Intangible ;
    schema:name "Mise sous boîtier (électronique)--Congrès"@en ;
    .

<http://id.worldcat.org/fast/907414> # Electronic packaging
    a schema:Intangible ;
    schema:name "Electronic packaging"@en ;
    .

<http://viaf.org/viaf/133657124> # University of Colorado (Boulder campus)
    a schema:Organization ;
    schema:name "University of Colorado (Boulder campus)" ;
    .


Content-negotiable representations

Close Window

Please sign in to WorldCat 

Don't have an account? You can easily create a free account.