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Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference ; presented at the ASME International Electronics Packaging Conference, Binghampton, New York, September 29 - October 2, 1993 Preview this item
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Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference ; presented at the ASME International Electronics Packaging Conference, Binghampton, New York, September 29 - October 2, 1993

Author: Peter A Engel; William T Chen; American Society of Mechanical Engineers.
Publisher: New York, N.Y. : The Society, ©1993.
Series: EEP (Series), v. 4.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Peter A Engel; William T Chen; American Society of Mechanical Engineers.
ISBN: 0791806863 9780791806869
OCLC Number: 29714471
Description: 2 volumes : illustrations ; 28 cm.
Contents: v. 1. Structural analysis, materials and processes, design, reliability --
v. 2. Thermal management, solder technology, optoelectronics packaging.
Series Title: EEP (Series), v. 4.
Responsibility: sponsored by the American Society of Mechanical Engineers ; edited by Peter A. Engel, William T. Chen.

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