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Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii Preview this item
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Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii

Author: Ephraim Suhir; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
Publisher: New York, N.Y : American Society of Mechanical Engineers, ©1997.
Series: EEP (Series), vol. 19.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
Summary:

These proceedings contain 302 papers presented at the June, 1997 conference. The papers are organized into five topical tracks: packaging technologies; emerging technologies; design, modeling and  Read more...

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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Ephraim Suhir; American Society of Mechanical Engineers. Electrical and Electronic Packaging Division.
ISBN: 0791815595 9780791815595
OCLC Number: 37294380
Description: 2 volumes : illustrations ; 28 cm.
Series Title: EEP (Series), vol. 19.
Other Titles: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference
INTERpack '97
Responsibility: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir [and others].

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