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Applied creep mechanics

Author: Thomas H Hyde; Wei Sun; Christopher J Hyde
Publisher: New York : McGraw-Hill, [2014]
Edition/Format:   Print book : EnglishView all editions and formats
Summary:

Complete coverage of design and life assessment methods for high-temperature components

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Document Type: Book
All Authors / Contributors: Thomas H Hyde; Wei Sun; Christopher J Hyde
ISBN: 9780071828697 0071828699 0071828702 9780071828703
OCLC Number: 856518450
Description: xiv, 370 pages : illustrations ; 23 cm
Contents: General solid mechanics background --
Material behavior models for creep analysis --
Stationary state creep of single-material, uncracked components --
Inferences from single-material, uncracked, stationary-state creep analyses --
Stationary-state creep of multimaterial uncracked components --
Examples of the application of the finite element method to the creep of single-material components --
Creep of welded components --
Creep of notched components --
Creep of cracked components --
Small-specimen creep testing.
Responsibility: Thomas H. Hyde, Wei Sun, Christopher J. Hyde.

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