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Attachment of free filament thermocouples for temperature measurements on CMC

Author: Jih-Fen Lei; Michael D Cuy; Stephen P Wnuk; Lewis Research Center,
Publisher: Cleveland, Ohio : National Aeronautics and Space Administration, Lewis Research Center, June 1997.
Series: NASA technical memorandum, 107488.
Edition/Format:   eBook : Document : National government publication : EnglishView all editions and formats
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Genre/Form: Online resources
Additional Physical Format: Print version:
Lei, Jih-Fen.
Attachment of free filament thermocouples for temperature measurements on CMC
(OCoLC)60402875
Microfiche version:
Lei, Jih-Fen.
Attachment of free filament thermocouples for temperature measurements on CMC
(OCoLC)40885034
Material Type: Document, Government publication, National government publication, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Jih-Fen Lei; Michael D Cuy; Stephen P Wnuk; Lewis Research Center,
OCLC Number: 844697506
Notes: "June 1997."
"Performing organization: National Aeronautics and Space Administration, Lewis Research Center"--Report documentation page.
Description: 1 online resource (7 pages) : illustrations.
Series Title: NASA technical memorandum, 107488.
Other Titles: Attachment of free filament thermocouples for temperature measurements on ceramic matrix composites
Responsibility: Jih-Fen Lei and Michael D. Cuy, Stephen P. Wnuk.

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