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Ball grid array technology

Author: John H Lau
Publisher: New York : McGraw-Hill, ©1995.
Series: Electronic packaging and interconnection series.
Edition/Format:   Print book : EnglishView all editions and formats

This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board, allowing a higher pin  Read more...


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Additional Physical Format: Online version:
Ball grid array technology.
New York : McGraw-Hill, ©1995
Document Type: Book
All Authors / Contributors: John H Lau
ISBN: 007036608X 9780070366084
OCLC Number: 31290401
Description: xviii, 636 pages : illustrations ; 24 cm.
Contents: Introduction to BGA technology; ceramic substrates for BGA packages; BT substrates for BGA packages; PCBs for BGA; ceramic BGA packages; ceramic BGA multichip carrier modules; plastic BGA packages; plastic BGA multichip carrier modules; plastic BGA assembly; thermal and electrical management of plastic BGA; reliability of plastic BGA assembly; inspection of BGA assembly; BGA tests and sockets; infrastructure to support BGA manufacturing.
Series Title: Electronic packaging and interconnection series.
Responsibility: John H. Lau, editor.


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