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Ceramic substrates and packages for electronic applications

Author: Man F Yan; American Ceramic Society. Electronics Division.; Yōgyō Kyōkai (Japan)
Publisher: Westerville, Ohio : American Ceramic Society, ©1989.
Series: Advances in ceramics, v. 26.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Online version:
International Symposium on Ceramic Substrates and Packages (1987 : Denver, Colo.).
Ceramic substrates and packages for electronic applications.
Westerville, Ohio : American Ceramic Society, ©1989
(OCoLC)645772457
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Man F Yan; American Ceramic Society. Electronics Division.; Yōgyō Kyōkai (Japan)
ISBN: 0916094359 9780916094355
OCLC Number: 20693019
Notes: "Proceedings of the International Symposium on Ceramic Substrates and Packages, sponsored by the Electronics Division of the American Ceramic Society and the Ceramic Society of Japan, held in Denver, CO, on October 18-21, 1987"--Title page verso.
Description: xi, 608 pages : illustrations ; 25 cm.
Series Title: Advances in ceramics, v. 26.
Responsibility: edited by Man F. Yan [and others].

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