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Characterization in silicon processing

Author: Yale Strausser; C Richard Brundle; Charles A Evans
Publisher: New York, NY : Momentum Press, 2010.
Series: Materials characterization series.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Summary:
With a focus on the use of materials characterization techniques for silicon-based semiconductors, this volume in the Materials Characterization series focuses on the process flow of silicon wafer manufacture where materials properties, processing and associated problems are brought to the fore. The book is organized by the types of materials commonly associated with integrated silicon semiconductor circuits and the  Read more...
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Characterization in silicon processing.
New York : Momentum Press, 2010
(OCoLC)607193462
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Yale Strausser; C Richard Brundle; Charles A Evans
ISBN: 9781606501115 1606501119 9781606501092 1606501097
OCLC Number: 752976145
Notes: "First published by Butterworth-Heinemann in 1995 ... Reissued volume published in 2010 by Momentum Press."--Title page verso.
Description: 1 online resource (xv, 240 pages) : illustrations.
Contents: Application of materials characterization techniques to silicon epitaxial growth / C.I. Drowley --
Polysilicon conductors / Yale Strausser --
Silicides / S.P. Murarka --
Aluminum- and copper-based conductors / David Fanger and Roger Tonneman --
Tungsten-based conductors / Roc Blumenthal and Gregory C. Smith --
Barrier films / M. Lawrence A. Dass.
Series Title: Materials characterization series.
Other Titles: Silicon processing
Responsibility: editor, Yale Strausser ; series editors, C. Richard Brundle and Charles A. Evans.
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Abstract:

With a focus on the use of materials characterization techniques for silicon-based semiconductors, this volume focuses on the process flow of silicon wafer manufacture where materials properties,  Read more...

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