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Chemical-Mechanical Polishing 2000 : fundamentals and materials issues : symposium held April 26-27, 2000, San Francisco, California, U.S.A.

Author: R K Singh
Publisher: Warrendale, Pa. : Materials Research Society, ©2001.
Series: Materials Research Society symposia proceedings, v. 613.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
Database:WorldCat
Summary:

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

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Genre/Form: Conference papers and proceedings
San Francisco (Calif., 2000)
Kongress
Congresses
Material Type: Conference publication, Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: R K Singh
ISBN: 1558995218 9781558995215
OCLC Number: 46521027
Description: 1 volume (various pagings) : illustrations ; 24 cm.
Contents: CMP Mechanisms --
Effect of Wafer Shape on Slurry Film Thickness and Friction Coefficients in Chemical Mechanical Planarization / Joseph Lu, Jonathan Coppeta, Chris Rogers, Vincent P. Manno, Livia Racz, Ara Philipossian, Mansour Moinpour, Frank Kaufman E1.2 --
A Model of Chemical Mechanical Polishing / Ed Paul E1.4 --
Modeling on Mechanical Properties of Polishing Pads in CMP Process / Takeshi Nishioka, Satoko Iwami, Takashi Kawakami, Yoshikuni Tateyama, Hiroshi Ohtani, Naoto Miyashita E1.5 --
Fundamental Studies on the Mechanisms of Oxide CMP / Uday Mahajan, Seung-Mahn Lee, Rajiv K. Singh E1.7 --
Dielectric and Metal CMP --
Planarization of Cu and Ta Using Silica and Alumina Abrasives--A Comparison / Y. Li, S. Ramarajan, M. Hariharaputhiran, Y.S. Her, S.V. Babu E2.4 --
Chemical Wear of Cu CMP / Hong Liang, Jean-Michel Martin, Beatrice Vacher, Vlasta Brusic E2.5 --
Poster Session: Dielectric and Metal CMP --
A Novel Single Step Lapping and Chemo-Mechanical Polishing Schem for Antimonide Based Semiconductors Using 1 [mu]m Agglomerate-Free Alumina Slurry / P.S. Dutta, R.J. Gutmann, D. Keller, L. Sweet E4.1 --
Multi-Level Damascene Process Development: Aluminum CMP / David A. Hansen, Gerry Moloney, Alex Reyes E4.3 --
Poster Session: Process Integration and Manufacturability --
Improvement of Wafer Edge Profile and CMP Performance Through the Floating Head Design / Huey-Ming Wang, Gerry Moloney, Mario Stella, Sesinando DeGuzman E5.1 --
A New Poly-Si CMP Process With Small Erosion for Advanced Trench Isolation Process / Naoto Miyashita, Shin-ichiro Uekusa, Takeshi Nishioka, Satoko Iwami E5.3 --
Characteristics of the Electrolyzed D.I. Water With Chemicals and the Outline of the Supply System / Mitsuhiko Shirakashi, Kenya Itoh, Ichiro Katakabe, Mamabu Tsujimura, Takayuki Saitoh, Kaoru Yamada, Naoto Miyashita, Masako Kodera, Yoshitaka Matsui E5.4 --
Poster Session: CMP Consumables --
An Image Analysis Technique for Assessing Particle Size and Agglomeration Tendency of Slurries / Susan R. Machinski, Kathleen A. Richardson, Aristide Dogariu E6.1 --
Performance of Polishing Slurries Containing Silica Particles Grown by Sol-Gel Method / Sun Hyuk Bae, Jae-Hyun So, Seung-Man Yang, Do Hyun Kim E6.5 --
Optical Characterization of Porous Membranes / Claudia Mujat, Lorrene Denney, Aristide Dogariu E6.10 --
CMP Consumables --
Interfacial Fluid Pressure and Its Effects on SiO[subscript 2] Chemical Mechanical Polishing / C. Zhou, L. Shan, J.R. Hight, S.H. Ng, A.J. Paszkowski, J. Tichy, S. Danyluk E7.1 --
Dynamic Mechanical Analysis (DMA) of CMP Pad Materials / Irene Li, Kersten M. Forsthoefel, Kathleen A. Richardson, Yaw S. Obeng, William G. Easter, Alvaro Maury E7.3 --
An Evaluation of the Effects of Benzotriazole in NH[subscript 4]OH Slurry for Copper CMP / V.S.C. Len, D.W. McNeill, H.S. Gamble E7.4 --
Fundamental Study of Iodate and Iodine Based Slurries for Copper CMP / Seung-Mahn Lee, Uday Mahajan, Zhan Chen, Rajiv K. Singh E7.8 --
Process Integration and Manufacturability --
Technique of Surface Control With the Electrolyzed D.I. Water for Post CMP Cleaning / Mitsuhiko Shirakashi, Kenya Itoh, Ichiro Katakabe, Masayuki Kamezawa, Sachiko Kihara, Manabu Tsujimura, Takayuki Saitoh, Kaoru Yamada, Naoto Miyashita, Masako Kodera, Yoshitaka Matsui E8.3 --
Removal Rate, Uniformity and Defectivity Studies of Chemical Mechanical Polishing of BPSG Films / Benjamin A. Bonner, Boris Fishkin, Jeffrey David, Chad Garretson, Thomas H. Osterheld E8.6 --
Using Wafer-Scale Patterns for CMP Analysis / Brian Lee, Terence Gan, Duane S. Boning, Jeffrey David, Benjamin A. Bonner, Peter McKeever, Thomas H. Osterheld E8.8 --
Planarization of Cooper Damascene Interconnects by Spin-Etch Process: A Chemical Approach / Shyama P. Mukherjee, Joseph A. Levert, Donald S. DeBear E8.10.
Series Title: Materials Research Society symposia proceedings, v. 613.
Responsibility: editors, Rajiv K. Singh [and others].
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