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Collection of papers presented at the Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS : Montpellier, France, 27-30 April 2015

Author: B Charlot; Centre national de la recherche scientifique (France),; Components, Packaging & Manufacturing Technology Society,; CMP (Firm),; Institute of Electrical and Electronics Engineers,
Publisher: [Piscataway, NJ] : IEEE, [2015?] ©2015
Edition/Format:   eBook : Document : Conference publication : EnglishView all editions and formats
Summary:
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The goal of the Symposium is to provide a forum for in depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems.

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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication, Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: B Charlot; Centre national de la recherche scientifique (France),; Components, Packaging & Manufacturing Technology Society,; CMP (Firm),; Institute of Electrical and Electronics Engineers,
OCLC Number: 917875209
Notes: "IEEE Catalog Number: CFP15DTI-ART"--PDF copyright page.
Description: 1 online resource : illustrations
Other Titles: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
DTIP 2015
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Responsibility: editors, Benoit Charlot, IES, University of Montpellier, France [and six others].

Abstract:

Annotation

The goal of the Symposium is to provide a forum for in depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems.

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