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COMPONENTS PACKAGING TECHNIQUES.

Author: George R Beck; TRW SPACE TECHNOLOGY LABS LOS ANGELES CALIF.
Publisher: Ft. Belvoir Defense Technical Information Center 31 DEC 1959.
Edition/Format:   Print book : EnglishView all editions and formats
Database:WorldCat
Summary:
This report summarizes and evaluates the present status of studies on electronic components packaging techniques described in PROJECT PLAN 165-21. These studies were conducted in four specific areas: (1) design technique studies, (2) materials and processes investigations, (3) microminiaturization and mechanized production studies, and (4) environmental test and vibration studies. For the design technique studies,  Read more...
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Document Type: Book
All Authors / Contributors: George R Beck; TRW SPACE TECHNOLOGY LABS LOS ANGELES CALIF.
OCLC Number: 227359674
Description: 1 page

Abstract:

This report summarizes and evaluates the present status of studies on electronic components packaging techniques described in PROJECT PLAN 165-21. These studies were conducted in four specific areas: (1) design technique studies, (2) materials and processes investigations, (3) microminiaturization and mechanized production studies, and (4) environmental test and vibration studies. For the design technique studies, the test vehicle selected consists of advanced gyro and digital programming circuits which are being packaged using both conventional printed circuit and advanced techniques. In the materials and processes investigations, the limitations of foam encapsulation caused by thermal effects have been analyzed. Investigation was started of capacitance discharge techniques for welding electronic part leads into circuits. The state of the art of microminiaturization has been reviewed in a survey of work in progress at numerous organizations in the electronics industry. Sinusoidal vibration testing, commonly employed in military qualification tests, has been compared in the laboratory with random vibration; equivalence data resulting from these tests are reported. The low-pressure electrical discharge study has been completed. (Author).

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Primary Entity

<http://www.worldcat.org/oclc/227359674> # COMPONENTS PACKAGING TECHNIQUES.
    a schema:CreativeWork, schema:Book ;
   library:oclcnum "227359674" ;
   library:placeOfPublication <http://experiment.worldcat.org/entity/work/data/767157771#Place/ft_belvoir> ; # Ft. Belvoir
   library:placeOfPublication <http://id.loc.gov/vocabulary/countries/vau> ;
   schema:about <http://experiment.worldcat.org/entity/work/data/767157771#Topic/printed_circuits> ; # Printed circuits
   schema:about <http://experiment.worldcat.org/entity/work/data/767157771#Topic/expanded_plastics> ; # Expanded plastics
   schema:about <http://experiment.worldcat.org/entity/work/data/767157771#Topic/packaging> ; # Packaging
   schema:about <http://experiment.worldcat.org/entity/work/data/767157771#Topic/subminiature_electronic_equipment> ; # Subminiature electronic equipment
   schema:about <http://experiment.worldcat.org/entity/work/data/767157771#Topic/vibration> ; # Vibration
   schema:about <http://experiment.worldcat.org/entity/work/data/767157771#Topic/quality_control> ; # Quality control
   schema:about <http://experiment.worldcat.org/entity/work/data/767157771#Topic/guided_missile_components> ; # Guided missile components
   schema:about <http://experiment.worldcat.org/entity/work/data/767157771#Topic/welding> ; # Welding
   schema:about <http://experiment.worldcat.org/entity/work/data/767157771#Topic/gyroscopes> ; # Gyroscopes
   schema:about <http://experiment.worldcat.org/entity/work/data/767157771#Topic/reliability_electronics> ; # Reliability(electronics)
   schema:about <http://experiment.worldcat.org/entity/work/data/767157771#Topic/encapsulation> ; # Encapsulation
   schema:bookFormat bgn:PrintBook ;
   schema:contributor <http://experiment.worldcat.org/entity/work/data/767157771#Organization/trw_space_technology_labs_los_angeles_calif> ; # TRW SPACE TECHNOLOGY LABS LOS ANGELES CALIF.
   schema:contributor <http://experiment.worldcat.org/entity/work/data/767157771#Person/beck_george_r> ; # George R. Beck
   schema:datePublished "31 DEC 1959" ;
   schema:datePublished "1959" ;
   schema:description "This report summarizes and evaluates the present status of studies on electronic components packaging techniques described in PROJECT PLAN 165-21. These studies were conducted in four specific areas: (1) design technique studies, (2) materials and processes investigations, (3) microminiaturization and mechanized production studies, and (4) environmental test and vibration studies. For the design technique studies, the test vehicle selected consists of advanced gyro and digital programming circuits which are being packaged using both conventional printed circuit and advanced techniques. In the materials and processes investigations, the limitations of foam encapsulation caused by thermal effects have been analyzed. Investigation was started of capacitance discharge techniques for welding electronic part leads into circuits. The state of the art of microminiaturization has been reviewed in a survey of work in progress at numerous organizations in the electronics industry. Sinusoidal vibration testing, commonly employed in military qualification tests, has been compared in the laboratory with random vibration; equivalence data resulting from these tests are reported. The low-pressure electrical discharge study has been completed. (Author)."@en ;
   schema:exampleOfWork <http://worldcat.org/entity/work/id/767157771> ;
   schema:inLanguage "en" ;
   schema:name "COMPONENTS PACKAGING TECHNIQUES."@en ;
   schema:productID "227359674" ;
   schema:publication <http://www.worldcat.org/title/-/oclc/227359674#PublicationEvent/ft_belvoirdefense_technical_information_center31_dec_1959> ;
   schema:publisher <http://experiment.worldcat.org/entity/work/data/767157771#Agent/defense_technical_information_center> ; # Defense Technical Information Center
   wdrs:describedby <http://www.worldcat.org/title/-/oclc/227359674> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/767157771#Agent/defense_technical_information_center> # Defense Technical Information Center
    a bgn:Agent ;
   schema:name "Defense Technical Information Center" ;
    .

<http://experiment.worldcat.org/entity/work/data/767157771#Organization/trw_space_technology_labs_los_angeles_calif> # TRW SPACE TECHNOLOGY LABS LOS ANGELES CALIF.
    a schema:Organization ;
   schema:name "TRW SPACE TECHNOLOGY LABS LOS ANGELES CALIF." ;
    .

<http://experiment.worldcat.org/entity/work/data/767157771#Person/beck_george_r> # George R. Beck
    a schema:Person ;
   schema:familyName "Beck" ;
   schema:givenName "George R." ;
   schema:name "George R. Beck" ;
    .

<http://experiment.worldcat.org/entity/work/data/767157771#Topic/guided_missile_components> # Guided missile components
    a schema:Intangible ;
   schema:name "Guided missile components"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/767157771#Topic/reliability_electronics> # Reliability(electronics)
    a schema:Intangible ;
   schema:name "Reliability(electronics)"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/767157771#Topic/subminiature_electronic_equipment> # Subminiature electronic equipment
    a schema:Intangible ;
   schema:name "Subminiature electronic equipment"@en ;
    .


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