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Cooling of microelectronic and nanoelectronic equipment : advances and emerging research

Author: Madhusudan Iyengar; Karl J L Geisler; Bahgat Sammakia
Publisher: Singapore : World Scientific Publishing Company, 2015. ©2015
Series: WSPC series in advanced integration and packaging, Volume 3.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Summary:
To celebrate Professor Avi Bar-Cohen''s 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets,  Read more...
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Cooling of microelectronic and nanoelectronic equipment : advances and emerging research.
Singapore : World Scientific Publishing Company, ©2015
x, 460 pages
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Madhusudan Iyengar; Karl J L Geisler; Bahgat Sammakia
ISBN: 9789814579797 9814579793
OCLC Number: 893672993
Description: 1 online resource (471 pages) : illustrations (some color).
Contents: Dedication; Contents; 1. A Review of Cooling Road Maps for 3D Chip Packages; Introduction; TSV Fabrication; Thermal-Mechanical-Electrical Challenges in 3-D; Acknowledgement; References; 2. Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks; 1. Introduction; 2. Passive Immersion Cooling; 2.1. Single Phase Natural Convection; 2.2. Pool Boiling; 3. Pumped Liquid Systems; 3.1. Single Phase Forced Convection; 3.2. Flow Boiling; 4. Performance Maps; 5. Conclusions; References; 3. Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency; 1. Introduction. 1.1. Thermal Issues in Modern Computer Chips1.2. Dynamic Thermal Management; 1.3. Temperature-leakage Interdependency; 1.4. Motivation of DTM Considering Temperature-leakage Interdependency; 2. RC Thermal Model Considering Leakage; 2.1. Single Core RC Thermal Model; 2.2. Leakage and Temperature Dependency; 2.3. Thermal Model with Leakage Power; 2.3.1. Case 1; 2.3.2. Case 2; 2.3.3. Case 3; 3. Thermal Aware Speed and Task Scheduling; 3.1. Problem Formulation; 3.2. Dynamic Programming with Fixed Task Order; 3.3. Considering Task Rescheduling; 3.3.1. Dynamic Programming with Task Scheduling. 3.3.2. Heuristic to Improve the Computation Speed4. Simulated Test Case; 4.1. Comparison 1: With Existing Leakage-temperature Models; 4.2. Comparison 2: Fixed Order, Full Rescheduling and Grouping; 5. Conclusion and Future Work; 5.1. Conclusion; 5.2. Future Work; Acknowledgments; References; 4. Energy Reduction and Performance Maximization Through Improved Cooling; Introduction; Leakage Current Effects; Improved Cooling; Performance Modeling; Reliability Concerns; Frequency Improvements; System Performance; Total Cost of Ownership; Conclusions; Acknowledgments; References. 5. Optimal Choice of Heat Sinks from an Industrial Point of View1. Introduction; 2. Heat Sink Basics; 2.1. The Murray-Gardner assumptions; 2.2. Heat spreading; 2.3. Radiation; 3. Heat Sink Modeling Approaches from a Designer's Perspective; 3.1. Approaches not recommended; 3.2. Approaches to acquire insight in the basic physics; 3.3. Approaches to acquire insight in optimization parameters; 3.4. Approaches to acquire insight in fluid dynamics; 3.5. Approaches suited for final design of heat sinks in LED applications; 3.6. Pitfalls to avoid; 3.7. Why more expensive heat sinks can save money. 4. ConclusionsReferences; 6. Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems; Introduction; Background; Synthetic Jets Design and Measurement Approaches; Numerical Modeling of a Synthetic Jet; Heat Transfer Experiments; Velocity Measurements; Pressure Measurements; Enhancing Heat Transfer with Synthetic Jets; Natural Convection Heat Transfer with Synthetic Jets; Enhancing Heat Sink Thermal Performance with Embedded Synthetic Jets; Forced Convection Heat Transfer with Synthetic Jets; Synthetic Jets in Practical Applications; Synthetic Jet Heat Transfer Correlation.
Series Title: WSPC series in advanced integration and packaging, Volume 3.
Responsibility: Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia, editors.

Abstract:

To celebrate Professor Avi Bar-Cohen''s 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of.

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