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Copper wire bonding

Author: Preeti S Chauhan; Anupam Choubey; ZhaoWei Zhong; Michael Pecht
Publisher: New York : Springer, [2013?] ©2014
Edition/Format:   eBook : Document : EnglishView all editions and formats
Database:WorldCat
Summary:
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process  Read more...
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Genre/Form: Electronic books
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Preeti S Chauhan; Anupam Choubey; ZhaoWei Zhong; Michael Pecht
ISBN: 9781461457619 1461457610
OCLC Number: 859591340
Description: 1 online resource (xxvi, 235 pages) : illustrations
Contents: Copper Wire Bonding --
Bonding Process --
Bonding Metallurgies --
Wire Bond Evaluation --
Thermal Reliability Tests --
Humidity and Electromigration Tests --
Wire Bond Pads --
Concerns and Solutions --
Recommendations --
Appendix A: Reliability Data --
Appendix B: Patents on Copper Wire Bonding.
Responsibility: Preeti S. Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht.
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From the reviews: "The book gives a wide perspective on the technical insights of copper wire bonding deployment in industry while adding very valuable industry insights. It is a good resource to Read more...

 
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