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Creep and stress relaxation in miniature structures and components : proceeding of a symposium

Author: H D Merchant; Minerals, Metals and Materials Society. Non-ferrous Metals Committee.
Publisher: Warrendale, PA : Minerals, Metals & Materials Society, ©1996.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: H D Merchant; Minerals, Metals and Materials Society. Non-ferrous Metals Committee.
ISBN: 0873393732 9780873393737
OCLC Number: 37322505
Description: viii, 299 pages : illustrations ; 24 cm
Contents: Modeling creep in complex engineering alloys / X.J. Wu and A.K. Koul --
Stress relaxation in impression test / J.C.M. Li --
Using superplastic flow to process nanocrystalline ceramics / M.J. Mayo and D.C. Hague --
Stress relaxation and creep of 12 to 35 [mu]m copper foil / H.D. Merchant --
Stress relaxation of Cu-Ti alloy C199 / J. Miyake, T. Kimura and T. Endo --
Nonlinear dynamics with transport system analogies applied to time-dependent materials / S. Russell --
Description of nonlinear viscoelastic creep : a challenge to material science / B. Möginger --
Viscoelastic performance of poly(tetrafluoro ethylene) in the [alpha]-transition region /F.-J. Wortmann --
Hygrothermal effects upon stress relaxation in a polyimide film / B.D. Harper [and others] --
Impression recovery of polymers / F. Yang, S. Zhang and J.C.M. Li --
Micro-indentation relaxation measurements in polymer thin films / D.M. Shinozaki, Y. Lu --
Stress relaxation in molding compounds / V.H. Kenner, B.D. Harper and V.Y. Itkin --
The short and long term properties of a liquid crystalline polymer at elevated temperatures : characterization and modeling / V. DiFilippo, A. Saigal and M.A. Zimmerman --
Creep, stress relaxation and plastic deformation in Sn-Ag and Sn-Zn eutectic solders / H. Mavoori. [and others] --
Tensile, creep and ABI tests on Sn5%Sb solder for mechanical property evaluation / K.L. Murty, F.M. Haggag and R.K. Mahidhara --
Finite element modeling of thermal fatigue and damage of solder joints in a ceramic ball grid array package / B.Z. Hong --
Microstructure coarsening during thermo-mechanical fatigue and damage of solder joints in a ceramic ball grid array package / B.Z. Hong --
Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints / P.L. Hacke, A.F. Sprecher and H. Conrad --
Partially-constrained thermomechanical fatigue of eutectic tinbismuth copper electronic solder joints / C.H. Raeder, R.W. Messler, Jr. and L.F. Coffin, Jr. --
Interfacial sliding in Cu/Ta/polymide high density interconnects as a result of thermal cycling / D.V. Zhmurkin, T.S. Gross and L.P. Buchwalter --
Implications and applications of zero creep experiments for the stability of multilayer structures / D. Josell and W.C. Carter Thickness dependent mechanical behavior of submicron aluminum films / Y.-S. Kang [and others].
Responsibility: sponsored by the Non-Ferrous Metals Committee of the Structural Materials Division (SMD) of Minerals, Metals and Materials Society held during Materials Week '96 in Cincinnati, Ohio, October 8-9, 1996 ; edited by Harish D. Merchant.

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