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Data mining and diagnosing IC fails
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Data mining and diagnosing IC fails

Author: Leendert M Huisman
Publisher: New York : Springer, 2005.
Series: Frontiers in electronic testing.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Summary:
"The purpose of the book is to bring together in one place a large number of analysis, data mining and diagnosis techniques that have proven to be useful in analyzing IC fails. The descriptions of the techniques and analysis routines is sufficiently detailed that profession manufacturing engineers can implement them in their own work environment."--Jacket.
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Huisman, Leendert M.
Data mining and diagnosing IC fails.
New York : Springer, c2005
(DLC) 2005050147
(OCoLC)60558678
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Leendert M Huisman
ISBN: 0387249931 9780387249933 9780387263519 0387263519 9786610613502 6610613508
OCLC Number: 76869285
Description: 1 online resource (270 p.) : ill.
Contents: Introduction.- Statistics.- Yield Statistics.- Area Dependence of the Yield.- Statistics of Embedded Object Fails.- Fail Commonalities.- Spatial Patterns.- Test Coverage and Test Fallout.- Logic Diagnosis.- Slat Based Diagnosis.- Data Collection Requirements.- Appendix A. Distribution of IC Fails.- Appendix B. General Yield Model.- Appendix C. Simplified Center-Satellite Model.- Appendix D. Quadrat Analysis.- Appendix E. Cell Fail Probabilities.- Appendix F. Characterization Group.- Appendix G. Component Fail Probabilities.- Appendix H. Yield and Coverage.- Appendix I. Estimating First Fail Probabilities from the Fallout.- Appendix J. Identity of M and S.- References.- Index.
Series Title: Frontiers in electronic testing.
Responsibility: Leendert M. Huisman.
More information:

Abstract:

There are many techniques for analyzing IC fails. This book addresses the problem of obtaining maximum information from (functional) integrated circuit fail data about the defects that caused the  Read more...

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