コンテンツへ移動
Design for high performance, low power, and reliable 3D integrated circuits 資料のプレビュー
閉じる資料のプレビュー
確認中…

Design for high performance, low power, and reliable 3D integrated circuits

著者: Sung Kyu Lim
出版: New York ; London : Springer, ©2013.
エディション/フォーマット:   電子書籍 : Document : Englishすべてのエディションとフォーマットを見る
データベース:WorldCat
概要:
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of timing, power, signal integrity, and thermo-mechanical reliability for 3D IC designs. Coverage also includes various  続きを読む
評価:

(まだ評価がありません) 0 件のレビュー - 是非あなたから!

件名:
関連情報:

 

オンラインで入手

この資料へのリンク

オフラインで入手

&AllPage.SpinnerRetrieving; この資料の所蔵館を検索中…

詳細

ジャンル/形式: Electronic books
その他のフォーマット: Print version:
Lim, Sung Kyu.
Design for high performance, low power, and reliable 3D integrated circuits.
New York ; London : Springer, 2012
(OCoLC)819520313
資料の種類: Document, インターネット資料
ドキュメントの種類: インターネットリソース, コンピューターファイル
すべての著者/寄与者: Sung Kyu Lim
ISBN: 9781441995421 1441995420 1441995412 9781441995414
OCLC No.: 821614862
物理形態: 1 online resource (xxviii, 560 p.) : b ill. (some col.)
コンテンツ: Regular vs Irregular TSV Placementfor 3D IC --
Steiner Routingfor 3D IC --
Buffer Insertion for 3D IC.- Low Power Clock Routing for 3D IC --
Power Delivery Network Design for 3D IC --
3D Clock Routing for Pre-bond Testability --
TSV-to-TSV Coupling Analysis and Optimization --
TSV Current Crowding and Power Integrity --
Modeling of Atomic Concentration at the Wire-to-TSV Interface --
Multi-Objective Archetectural Floorplanning for 3D IC --
Thermal-aware Gate-level Placement for 3D IC --
3D IC Cooling with Micro-Fluidic Channels --
Mechanical Reliability Analysis and Optimization for 3D IC --
Impact of Mechanical Stress on Timing Variation for 3D IC --
Chip/Package Co-Analysis of Mechanical Stress for 3D IC --
3D Chip/Packaging Co-Analysis of Stress-Induced Timing Variations --
TSV Interfracial Crack Analysis and Optimization --
Ultra High Logic Designs Using Monolithic 3D Integration --
Impact of TSV Scaling on 3D IC Design Quality --
3D-MAPS: 3DMassively Parallel Processor with Stacked Memory.
責任者: Sung Kyu Lim.

概要:

This book describes a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It provides full details of  続きを読む

レビュー

ユーザーレビュー
GoodReadsのレビューを取得中…
DOGObooksのレビューを取得中…

タグ

まずはあなたから!
リクエストの確認

あなたは既にこの資料をリクエストしている可能性があります。このリクエストを続行してよろしければ、OK を選択してください。

リンクデータ


Primary Entity

<http://www.worldcat.org/oclc/821614862> # Design for high performance, low power, and reliable 3D integrated circuits
    a schema:Book, schema:MediaObject, schema:CreativeWork ;
    library:oclcnum "821614862" ;
    library:placeOfPublication <http://dbpedia.org/resource/New_York_City> ; # New York
    library:placeOfPublication <http://dbpedia.org/resource/London> ; # London
    library:placeOfPublication <http://id.loc.gov/vocabulary/countries/nyu> ;
    schema:about <http://experiment.worldcat.org/entity/work/data/1183874594#Topic/computers_computer_graphics> ; # Computers--Computer Graphics
    schema:about <http://dewey.info/class/621.3815/e23/> ;
    schema:about <http://experiment.worldcat.org/entity/work/data/1183874594#Topic/computer_programs_design> ; # Computer Programs--Design
    schema:about <http://experiment.worldcat.org/entity/work/data/1183874594#Topic/ingenierie> ; # Ingénierie
    schema:about <http://id.loc.gov/authorities/subjects/sh91000149> ; # Computer algorithms
    schema:about <http://experiment.worldcat.org/entity/work/data/1183874594#Topic/three_dimensional_integrated_circuits_design_and_construction> ; # Three-dimensional integrated circuits--Design and construction
    schema:about <http://experiment.worldcat.org/entity/work/data/1183874594#Topic/three_dimensional_display_systems> ; # Three-dimensional Display Systems
    schema:about <http://experiment.worldcat.org/entity/work/data/1183874594#Topic/computers_software_development_&_engineering_general> ; # Computers--Software Development & Engineering--General
    schema:about <http://experiment.worldcat.org/entity/work/data/1183874594#Topic/technology_&_engineering_electronics_circuits_general> ; # TECHNOLOGY & ENGINEERING / Electronics / Circuits / General
    schema:about <http://experiment.worldcat.org/entity/work/data/1183874594#Topic/integrated_circuits> ; # Integrated Circuits
    schema:about <http://experiment.worldcat.org/entity/work/data/1183874594#Topic/technology_&_engineering_electronics_circuits_integrated> ; # Technology & Engineering--Electronics--Circuits--Integrated
    schema:about <http://id.worldcat.org/fast/872010> ; # Computer algorithms
    schema:bookFormat schema:EBook ;
    schema:copyrightYear "2013" ;
    schema:creator <http://viaf.org/viaf/58612788> ; # Sung Kyu Lim
    schema:datePublished "2013" ;
    schema:description "Regular vs Irregular TSV Placementfor 3D IC -- Steiner Routingfor 3D IC -- Buffer Insertion for 3D IC.- Low Power Clock Routing for 3D IC -- Power Delivery Network Design for 3D IC -- 3D Clock Routing for Pre-bond Testability -- TSV-to-TSV Coupling Analysis and Optimization -- TSV Current Crowding and Power Integrity -- Modeling of Atomic Concentration at the Wire-to-TSV Interface -- Multi-Objective Archetectural Floorplanning for 3D IC -- Thermal-aware Gate-level Placement for 3D IC -- 3D IC Cooling with Micro-Fluidic Channels -- Mechanical Reliability Analysis and Optimization for 3D IC -- Impact of Mechanical Stress on Timing Variation for 3D IC -- Chip/Package Co-Analysis of Mechanical Stress for 3D IC -- 3D Chip/Packaging Co-Analysis of Stress-Induced Timing Variations -- TSV Interfracial Crack Analysis and Optimization -- Ultra High Logic Designs Using Monolithic 3D Integration -- Impact of TSV Scaling on 3D IC Design Quality -- 3D-MAPS: 3DMassively Parallel Processor with Stacked Memory." ;
    schema:description "This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of timing, power, signal integrity, and thermo-mechanical reliability for 3D IC designs. Coverage also includes various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the 3D IC design process. Describes design issues and solutions for high performance and low power 3D ICs, such as the pros/cons of regular and irregular placement of TSVs, Steiner routing, buffer insertion, low power 3D clock routing, power delivery network design and clock design for pre-bond testability. Discusses topics in design-for-electrical-reliability for 3D ICs, such as TSV-to-TSV coupling, current crowding at the wire-to-TSV junction and the electro-migration failure mechanisms in TSVs. Covers design-for-thermal-reliability in 3D ICs, including thermal-aware architectural floorplanning, gate-level placement techniques to alleviate thermal problems, and co-design and co-analysis of thermal, power delivery, and performance. Includes issues affecting design-for-mechanical-reliability in 3D ICs, such as the co-efficient of thermal expansion (CTE) mismatch between TSV and silicon substrate, device mobility and full-chip timing variations, and the impact of package elements." ;
    schema:exampleOfWork <http://worldcat.org/entity/work/id/1183874594> ;
    schema:genre "Electronic books" ;
    schema:inLanguage "en" ;
    schema:isSimilarTo <http://www.worldcat.org/oclc/819520313> ;
    schema:name "Design for high performance, low power, and reliable 3D integrated circuits" ;
    schema:numberOfPages "560" ;
    schema:productID "821614862" ;
    schema:publication <http://www.worldcat.org/title/-/oclc/821614862#PublicationEvent/new_york_london_springer_c2013> ;
    schema:publisher <http://experiment.worldcat.org/entity/work/data/1183874594#Agent/springer> ; # Springer
    schema:url <http://swb.eblib.com/patron/FullRecord.aspx?p=1030866> ;
    schema:url <http://swbplus.bsz-bw.de/bsz431237026cov.htm> ;
    schema:url <http://site.ebrary.com/id/10631373> ;
    schema:url <http://link.springer.com/openurl?genre=book&isbn=978-1-4419-9541-4> ;
    schema:url <http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=528267> ;
    schema:url <http://lib.myilibrary.com?id=417738> ;
    schema:url <http://dx.doi.org/10.1007/978-1-4419-9542-1> ;
    schema:workExample <http://worldcat.org/isbn/9781441995421> ;
    schema:workExample <http://worldcat.org/isbn/9781441995414> ;
    wdrs:describedby <http://www.worldcat.org/title/-/oclc/821614862> ;
    .


Related Entities

<http://dbpedia.org/resource/London> # London
    a schema:Place ;
    schema:name "London" ;
    .

<http://dbpedia.org/resource/New_York_City> # New York
    a schema:Place ;
    schema:name "New York" ;
    .

<http://experiment.worldcat.org/entity/work/data/1183874594#Topic/computer_programs_design> # Computer Programs--Design
    a schema:Intangible ;
    schema:name "Computer Programs--Design" ;
    .

<http://experiment.worldcat.org/entity/work/data/1183874594#Topic/computers_computer_graphics> # Computers--Computer Graphics
    a schema:Intangible ;
    schema:name "Computers--Computer Graphics" ;
    .

<http://experiment.worldcat.org/entity/work/data/1183874594#Topic/computers_software_development_&_engineering_general> # Computers--Software Development & Engineering--General
    a schema:Intangible ;
    schema:name "Computers--Software Development & Engineering--General" ;
    .

<http://experiment.worldcat.org/entity/work/data/1183874594#Topic/integrated_circuits> # Integrated Circuits
    a schema:Intangible ;
    schema:name "Integrated Circuits" ;
    .

<http://experiment.worldcat.org/entity/work/data/1183874594#Topic/technology_&_engineering_electronics_circuits_general> # TECHNOLOGY & ENGINEERING / Electronics / Circuits / General
    a schema:Intangible ;
    schema:name "TECHNOLOGY & ENGINEERING / Electronics / Circuits / General" ;
    .

<http://experiment.worldcat.org/entity/work/data/1183874594#Topic/technology_&_engineering_electronics_circuits_integrated> # Technology & Engineering--Electronics--Circuits--Integrated
    a schema:Intangible ;
    schema:name "Technology & Engineering--Electronics--Circuits--Integrated" ;
    schema:name "TECHNOLOGY & ENGINEERING / Electronics / Circuits / Integrated" ;
    .

<http://experiment.worldcat.org/entity/work/data/1183874594#Topic/three_dimensional_display_systems> # Three-dimensional Display Systems
    a schema:Intangible ;
    schema:name "Three-dimensional Display Systems" ;
    .

<http://experiment.worldcat.org/entity/work/data/1183874594#Topic/three_dimensional_integrated_circuits_design_and_construction> # Three-dimensional integrated circuits--Design and construction
    a schema:Intangible ;
    schema:hasPart <http://id.loc.gov/authorities/subjects/sh2011002115> ;
    schema:name "Three-dimensional integrated circuits--Design and construction" ;
    .

<http://id.loc.gov/authorities/subjects/sh91000149> # Computer algorithms
    a schema:Intangible ;
    schema:name "Computer algorithms" ;
    .

<http://id.worldcat.org/fast/872010> # Computer algorithms
    a schema:Intangible ;
    schema:name "Computer algorithms" ;
    .

<http://lib.myilibrary.com?id=417738>
    rdfs:comment "Connect to MyiLibrary resource." ;
    .

<http://viaf.org/viaf/58612788> # Sung Kyu Lim
    a schema:Person ;
    schema:familyName "Lim" ;
    schema:givenName "Sung Kyu" ;
    schema:name "Sung Kyu Lim" ;
    .

<http://worldcat.org/isbn/9781441995414>
    a schema:ProductModel ;
    schema:description "Trade Cloth" ;
    schema:isbn "1441995412" ;
    schema:isbn "9781441995414" ;
    .

<http://worldcat.org/isbn/9781441995421>
    a schema:ProductModel ;
    schema:description "electronic bk." ;
    schema:isbn "1441995420" ;
    schema:isbn "9781441995421" ;
    .

<http://www.worldcat.org/oclc/819520313>
    a schema:CreativeWork ;
    rdfs:label "Design for high performance, low power, and reliable 3D integrated circuits." ;
    schema:description "Print version:" ;
    schema:isSimilarTo <http://www.worldcat.org/oclc/821614862> ; # Design for high performance, low power, and reliable 3D integrated circuits
    .

<http://www.worldcat.org/title/-/oclc/821614862>
    a genont:InformationResource, genont:ContentTypeGenericResource ;
    schema:about <http://www.worldcat.org/oclc/821614862> ; # Design for high performance, low power, and reliable 3D integrated circuits
    schema:dateModified "2015-06-06" ;
    void:inDataset <http://purl.oclc.org/dataset/WorldCat> ;
    .


Content-negotiable representations

ウインドウを閉じる

WorldCatにログインしてください 

アカウントをお持ちではないですか?簡単に 無料アカウントを作成することができます。.