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Design for high performance, low power, and reliable 3D integrated circuits

Autor: Sung Kyu Lim
Editora: New York ; London : Springer, ©2013.
Edição/Formato   e-book : Documento : InglêsVer todas as edições e formatos
Base de Dados:WorldCat
Resumo:
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of timing, power, signal integrity, and thermo-mechanical reliability for 3D IC designs. Coverage also includes various  Ler mais...
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Detalhes

Gênero/Forma: Electronic books
Formato Físico Adicional: Print version:
Lim, Sung Kyu.
Design for high performance, low power, and reliable 3D integrated circuits.
New York ; London : Springer, 2012
(OCoLC)819520313
Tipo de Material: Documento, Recurso Internet
Tipo de Documento: Recurso Internet, Arquivo de Computador
Todos os Autores / Contribuintes: Sung Kyu Lim
ISBN: 9781441995421 1441995420
Número OCLC: 821614862
Descrição: 1 online resource (xxviii, 560 p.) : b ill. (some col.)
Conteúdos: Regular vs Irregular TSV Placementfor 3D IC --
Steiner Routingfor 3D IC --
Buffer Insertion for 3D IC.- Low Power Clock Routing for 3D IC --
Power Delivery Network Design for 3D IC --
3D Clock Routing for Pre-bond Testability --
TSV-to-TSV Coupling Analysis and Optimization --
TSV Current Crowding and Power Integrity --
Modeling of Atomic Concentration at the Wire-to-TSV Interface --
Multi-Objective Archetectural Floorplanning for 3D IC --
Thermal-aware Gate-level Placement for 3D IC --
3D IC Cooling with Micro-Fluidic Channels --
Mechanical Reliability Analysis and Optimization for 3D IC --
Impact of Mechanical Stress on Timing Variation for 3D IC --
Chip/Package Co-Analysis of Mechanical Stress for 3D IC --
3D Chip/Packaging Co-Analysis of Stress-Induced Timing Variations --
TSV Interfracial Crack Analysis and Optimization --
Ultra High Logic Designs Using Monolithic 3D Integration --
Impact of TSV Scaling on 3D IC Design Quality --
3D-MAPS: 3DMassively Parallel Processor with Stacked Memory.
Responsabilidade: Sung Kyu Lim.
Mais informações:

Resumo:

This book describes a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It provides full details of  Ler mais...

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