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Design, process integration, and characterization for microelectronics : 6-7 March 2002, Santa Clara, USA

Author: Alexander Starikov; Kenneth W Tobin; Society of Photo-optical Instrumentation Engineers.
Publisher: Bellingham, Wash. : Society of Photo-optical Instrumentation Engineers, ©2002.
Series: Proceedings of SPIE--the International Society for Optical Engineering, v. 4692.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Congresses
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Alexander Starikov; Kenneth W Tobin; Society of Photo-optical Instrumentation Engineers.
ISBN: 0819444391 9780819444394
OCLC Number: 50514162
Description: xv, 628 pages : illustrations (some color) ; 28 cm.
Contents: Process characterization and diagnostics in IC manufacturing: Metrology for process characterization ; Wafer inspection ; Defect data analysis ; Yield improvement and analysis ; Process control and characterization ; Poster session --
Design and process integration for microelectronics manufacturing: Integration : enabling the future ; Advanced RETs for 70 nm ; Design rules and design validation ; Design validation and ACLV ; Integration methods ; Panel discussion : Do we need a revolution in design and process integration to enable sub-100-nm technology nodes? ; Technology models and CAD ; Devices and patterning ; Layouts and RETs --
Chair's remarks: Scope and challenge of design and process integration --
Effects of coherence in image evauation / B.J. Thompson --
Transcript of colloquium, SPIE Seminar-in-Depth on Photo-Optical Systems Evaluation, Rochester, New York, 1967 --
Addendum.
Series Title: Proceedings of SPIE--the International Society for Optical Engineering, v. 4692.
Responsibility: Alexander Starikov, Kenneth W. Tobin, Jr., chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering.

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