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Diamond: A new high thermal conductivity substrate for multichip modules and hybrid circuits

Author: David Norwood; Walter Worobey; David Peterson; Doyle Miller; Sandia National Laboratories.; et al
Publisher: Albuquerque, N.M.: Sandia National Laboratories 1992.
Series: SAND (Series) (Albuquerque, N.M.), 92-2476 C.
Edition/Format:   Book   Microform : Microfiche : English
Database:WorldCat
Summary:
An application for hybrid circuits and multichip modules create demand for higher density circuits and higher power components, new substrate materials are required to deal with the heat generated on the circuit. Sandia is developing diamond substrate technology to meet the requirements of high thermal conductivity. Thin film processes were developed and characterized to delineate conductor-resistor networks on free  Read more...
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Document Type: Book
All Authors / Contributors: David Norwood; Walter Worobey; David Peterson; Doyle Miller; Sandia National Laboratories.; et al
OCLC Number: 703245481
Description: 11 pages.
Series Title: SAND (Series) (Albuquerque, N.M.), 92-2476 C.
Responsibility: David Norwood, et al.

Abstract:

An application for hybrid circuits and multichip modules create demand for higher density circuits and higher power components, new substrate materials are required to deal with the heat generated on the circuit. Sandia is developing diamond substrate technology to meet the requirements of high thermal conductivity. Thin film processes were developed and characterized to delineate conductor-resistor networks on free standing diamond substrates having fine line gold conductors and low and high sheet resistivity resistors. Thin film hybrid circuit technology was developed on CVD-processed, plycrystalline diamond substrates having as-deposited surface finishes as well as those with polished surfaces. Conductors were defined by pattern plating gold and resistors were processed from sputtered tantalum nitride films which were deposited to sheet resistivities of 5 and/or 100 ohms per square. ...

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