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Diffusion and stresses : proceedings of the International Workshop on Diffusion and Stresses, Lillafüred, Hungary, September 19-22, 2006

Author: D L Beke; Z Erdélyi; I A Szabó
Publisher: Switzerland : Trans Tech Publications Ltd, 2007. ©2007
Series: Diffusion and defect data., Pt. A,, Defect and diffusion forum ;, 264.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Summary:
The question of the interrelationship between diffusion and stress is almost as old as the investigation of diffusion itself. Nowadays, the study of various diffusion and solid-state reaction processes in thin films and multilayers is a vital area of research activity in which, inevitably, diffusion-induced or thermal stresses are of primary importance. This timely book covers all aspects of the interrelationship  Read more...
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Genre/Form: Electronic books
Conference papers and proceedings
Congresses
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: D L Beke; Z Erdélyi; I A Szabó
ISBN: 9783038131465 3038131466
OCLC Number: 868960584
Description: 1 online resource (181 pages) : illustrations.
Series Title: Diffusion and defect data., Pt. A,, Defect and diffusion forum ;, 264.
Responsibility: edited by D.L. Beke, Z. Erdélyi and I.A. Szabó.

Abstract:

The question of the interrelationship between diffusion and stress is almost as old as the investigation of diffusion itself. Nowadays, the study of various diffusion and solid-state reaction processes in thin films and multilayers is a vital area of research activity in which, inevitably, diffusion-induced or thermal stresses are of primary importance. This timely book covers all aspects of the interrelationship between stresses and diffusion phenomena occurring in bulk solids, thin films and multilayered materials and also those which take place at surfaces and interfaces. Such stress-effects are increasingly important at the nanoscale, and the topics covered are fully related to recent progress made in in the field and to the further challenges which are yet to be met.

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