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Electroless copper and nickel-phosphorus plating : processing, characterisation and modelling

Author: Wei Sha; Xiaomin Wu; K G Keong
Publisher: Cambridge, UK ; Philadelphia, PA : Woodhead Pub., 2011.
Series: Woodhead Publishing in materials.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Database:WorldCat
Summary:
Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions. After  Read more...
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Sha, Wei.
Electroless copper and nickel-phosphorus plating.
Cambridge, UK ; Philadelphia, PA : Woodhead Pub., 2011
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Wei Sha; Xiaomin Wu; K G Keong
ISBN: 0857090968 9780857090966
OCLC Number: 827454881
Description: 1 online resource (xviii, 285 pages) : illustrations.
Contents: Cover; Electroless copper and nickel-phosphorus plating: Processing, characterisation andmodelling; Copyright; Contents; Author contact details; Preface; Acknowledgements; 1Introduction to electroless copper andnickel-phosphorus (Ni-P) depositions; 1.1 Electroless copper deposition; 1.2 Electroless nickel-phosphorus (Ni-P) deposition; 1.3 How to plate the depositions in the laboratory; 1.4 Research objectives; 1.5 Structure of the book; 1.6 References; Part I Electroless copper depositions; 2Surface morphology evolution ofelectroless copper deposits. 2.1 Introduction and surface morphology of the substrate2.2 Formaldehyde high temperature solution deposits; 2.3 Glyoxylic acid high temperature solution deposits; 2.4 Formaldehyde high concentration low temperature (FHCLT) solution deposit; 2.5 Formaldehyde low concentration low temperature (FLCLT) solution deposit; 2.6 Glyoxylic acid high concentration low temperature (GHCLT) solution deposit; 2.7 Glyoxylic acid low concentration low temperature (GLCLT) solution deposit; 2.8 Electroplated and electroless copper deposits; 2.9 Conclusions. 3Cross-section of electroless copperdeposits and the void fraction3.1 Calculating the void fraction on an electron microscopy cross-section image; 3.2 Determination of the optimum threshold values of grey scale and noise; 3.3 The voids; 3.4 Conclusions; 3.5 References; 4 Crystal structure and surface residual stress of electroless copper deposits; 4.1 X-ray normal scan patterns and the crystal structures of the deposits; 4.2 Tilted scan patterns and the surface residual stress of the electroless copper; 4.3 The error in calculating the position and the relative intensities of the peaks. 4.4 The error in linear regression for surface residual stress analysis4.5 Conclusions; 5The atomic model of the diamond pyramidstructure in electroless copper deposits; 5.1 The unit diamond pyramid structure in a face centred cubic crystal lattice; 5.2 Multi-layer atomic model; 5.3 Twinning in the diamond pyramid model; 5.4 The role of surface stress in the formation of twinning in a diamond pyramid; 5.5 Conclusions; 5.6 References; 6Molecular dynamics (MD) simulation of thediamond pyramid structure in electrolesscopper deposits; 6.1 Simulation setup. 6.2 Preparing models for molecular dynamics calculation6.3 The effect of surface stress on the shape of the diamond pyramid structure; 6.4 The relaxation of the diamond pyramid structure with different sizes; 6.5 The effect of temperature on the relaxation of the diamond pyramid structure; 6.6 The effect of temperature on the formation of voids in the electroless deposit; 6.7 The formation and growth of the diamond pyramid structure in deposit; 6.8 The radial distribution function (RDF) and the Fourier transform of X-ray diffraction (XRD); 6.9 Conclusions.
Series Title: Woodhead Publishing in materials.
Responsibility: W. Sha, X. Wu and K.G. Keong.
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Abstract:

Written by leading experts in the field, this important book reviews the deposition process and the key properties of electroless copper and nickel-phosphorus deposits as well as their practical  Read more...

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The author's use of modelling brings a new level of fundamental understanding to the field., Materials World

 
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