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Electronic packaging and corrosion in microelectronics : proceedings of ASM's Third Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics, Minneapolis, Minnesota, 28-30 April 1987

Author: Morris E Nicholson; ASM International. Electronic Materials and Processing Division.; University of Minnesota. Corrosion Research Center.; ASM International. Minnesota Chapter.
Publisher: [Metals Park, Ohio] : ASM International, ©1987.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
Database:WorldCat
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Online version:
Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics (3rd : 1987 : Minneapolis, Minn.).
Electronic packaging and corrosion in microelectronics.
[Metals Park, Ohio] : ASM International, ©1987
(OCoLC)573748024
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: Morris E Nicholson; ASM International. Electronic Materials and Processing Division.; University of Minnesota. Corrosion Research Center.; ASM International. Minnesota Chapter.
ISBN: 0871702916 9780871702913
OCLC Number: 16784739
Description: viii, 296 pages : illustrations ; 29 cm
Responsibility: edited by Morris E. Nicholson ; sponsored by Electronic Materials and Processing Division of ASM International and Corrosion Research Center of the University of Minnesota in cooperation with the Minnesota Chapter of ASM International ; supported by Twin City Section of NACE, IEEE Reliability Society, IEEE Components, Hybrids and Manufacturing Technology Society.

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