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Electronic packaging : design, materials, process, and reliability

Author: John H Lau
Publisher: New York : McGraw-Hill, ©1998.
Series: Electronic packaging and interconnection series.
Edition/Format:   Print book : EnglishView all editions and formats
Summary:

Intended to be an electronic packaging resource, this text features writing from four leaders in the the four intertwined disciplines of packaging. Recent technological advances are discussed,  Read more...

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Details

Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: John H Lau
ISBN: 0070371350 9780070371354
OCLC Number: 39027908
Description: xxiv, 498 pages : illustrations ; 24 cm.
Contents: Preface --
Acknowledgments --
About the Authors --
Ch. 1. Introduction --
Ch. 2. Basic Electrical Effects in Electronic Packaging and Interconnects --
Ch. 3. Thermal Design, Analysis, and Measurement of Electronic Packaging --
Ch. 4. Mechanical Design, Analysis, Measurement, and Reliability of Electronic Packaging --
Ch. 5. Polymers for Electronic Packaging: Materials, Processes, and Reliability --
Index.
Series Title: Electronic packaging and interconnection series.
Responsibility: John H. Lau [and others].
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