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Electronic packaging for high reliability ; low cost elctronics

Author: Rao R Tummala
Publisher: Dordrecht ; Boston : Kluwer Academic, ©1999.
Series: NATO ASI series., Partnership sub-series 3,, High technology ;, vol. 57.
Edition/Format:   Print book : EnglishView all editions and formats
Database:WorldCat
Summary:

Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997

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Genre/Form: Bled (1997)
Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: Rao R Tummala
ISBN: 0792352181 9780792352181
OCLC Number: 39399096
Description: ix, 296 pages : illustrations ; 25 cm.
Contents: Possibilities of Thermal Resonance in Microcircuits / Gilbert De Mey --
Signal Integrity Analysis in Cost Sensitive Interconnections / Paul Svasta, Virgil Golumbeanu and Norocel-Dragos Codreanu / [and others] --
Use of Nonlinearity Measurements for the Reliability Assessment / P.J. Mach --
Effect of Plastic Package Geometry on its Propensity to Moisture Induced Failure / E. Suhir --
Impact of Stress on the Noise, Quality and Reliability of Passive and Active Devices / Josef Sikula and Petr Vasina --
Smart Unit for Technological Monitoring in Electrochemical Industry / Radu Ionescu, Sorin Ganciulescu and Dan Caravasile / [et al.].
Series Title: NATO ASI series., Partnership sub-series 3,, High technology ;, vol. 57.
Responsibility: edited by Rao Tummala [and others].
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