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Electronic thin-film reliability

Author: K N Tu
Publisher: Cambridge ; New York : Cambridge University Press, 2010.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Summary:
"Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the  Read more...
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Genre/Form: Electronic books
Textbooks
Additional Physical Format: Print version:
Tu, K.N. (King-ning), 1937-
Electronic thin film reliability.
Cambridge ; New York : Cambridge University Press, 2010
(DLC) 2010033855
(OCoLC)607986413
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: K N Tu
ISBN: 9780511906886 0511906889 9780511909689 0511909683 9780511777691 0511777698
OCLC Number: 692156961
Description: 1 online resource (xvi, 396 pages) : illustrations
Contents: Thin-film applications to microelectronic technology --
Thin-film deposition --
Surface energies --
Atomic diffusion in solids --
Applications of diffusion equation --
Elastic stress and strain in thin films --
Surface kinetic processes on thin films --
Interdiffusion and reaction in thin films --
Grain boundary diffusion --
Irreversible processes in interconnect and packaging technology --
Electromigration in metals --
Electromigration-induced failure in Al and Cu interconnects --
Thermomigration --
Stress migration in thin films --
Reliability science and analysis --Appendices: A.A brief review of thermodynamic functions --
B. Defect concentration in solids --
C. Derivation of Huntington's electron wind force --
D. Elastic constants tables and conversions --
E. Terrace size distribution in Si MBE --
F. Interdiffusion coefficient --
G. Table of physical properties.
Responsibility: King-Ning Tu.

Abstract:

Based on a graduate course at UCLA, this book describes reliability and failure of thin films.  Read more...

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