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Encapsulation technologies for electronic applications

Author: Haleh Ardebili; Michael Pecht
Publisher: Oxford : William Andrew, 2009.
Edition/Format:   Print book : EnglishView all editions and formats
Summary:

Offers a comprehensive discussion of encapsulants in electronic applications. This work emphasizes on the encapsulation of microelectronic devices. It discusses 2-D and 3-D packaging and  Read more...

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Document Type: Book
All Authors / Contributors: Haleh Ardebili; Michael Pecht
ISBN: 9780815515760 0815515766
OCLC Number: 286457010
Description: xvii, 480 pages : illustrations ; 24 cm
Contents: Introduction Trends and Challenges Defect and Failure Analysis Techniques for Encapsulated Microelectronics Characterization of Encapsulant Properties Encapsulation Process Technology Plastic Encapsulant Materials Encapsulation Defects and Failures Qualification and Quality Assurance
Responsibility: by Haleh Ardebili, Michael Pecht.

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