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Energy beam-solid interactions and transient thermal processing : symposium held November 1983 in Boston, Massachusetts, U.S.A.

Author: John C C Fan; Noble M Johnson
Publisher: New York : North-Holland, ©1984.
Series: Materials Research Society symposia proceedings, v. 23.
Edition/Format:   Print book : Conference publication : EnglishView all editions and formats
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Genre/Form: Conference papers and proceedings
Congresses
Additional Physical Format: Online version:
Energy beam-solid interactions and transient thermal processing.
New York : North-Holland, ©1984
(OCoLC)557821707
Material Type: Conference publication
Document Type: Book
All Authors / Contributors: John C C Fan; Noble M Johnson
ISBN: 0444009035 9780444009036
OCLC Number: 10800652
Description: xviii, 791 pages : illustrations ; 24 cm.
Contents: Soi technology for integrated circuits --
Plenary session --
Fundamental mechanisms --
Transilent thermal processing of silicon --
Defect mechanisms and crystallization of semiconductor on insulators --
Soi materials --
Soi materials and devices --
Compound semiconductors --
Metallic alloys.
Series Title: Materials Research Society symposia proceedings, v. 23.
Responsibility: editors, John C.C. Fan, Noble M. Johnson.

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