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Factors governing tin whisker growth

Author: Erika R Crandall
Publisher: Cham : Springer, ©2013.
Series: Springer theses.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Database:WorldCat
Summary:
Tin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (including satellite and defense sectors). Due to legislation in the EU, Japan, and the U.S., mandating a gradual shift  Read more...
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Crandall, Erika R.
Factors Governing Tin Whisker Growth.
Dordrecht : Springer, ©2013
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Erika R Crandall
ISBN: 9783319004709 3319004700 3319004697 9783319004693
OCLC Number: 858763882
Notes: "Doctoral thesis accepted by Auburn University, USA."
Description: 1 online resource (xii, 136 pages) : illustrations (some color).
Contents: Whiskers and Their Role in Component Reliability --
Film/Substrate Effects on Whisker Growth --
Environmental Effects of Whisker Growth --
Whisker Mitigation and Prevention --
Conclusions.
Series Title: Springer theses.
Responsibility: Erika R. Crandall.
More information:

Abstract:

This book examines formation of whiskers on tin film surfaces, using reproducible laboratory-created whiskers under a variety of controlled environmental factors. Discusses how to impede or prevent  Read more...

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