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Factors Governing Tin Whisker Growth.

Author: Erika R Crandall
Publisher: Dordrecht : Springer, 2013.
Series: Springer theses.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Database:WorldCat
Summary:
Tin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (including satellite and defense sectors). Due to legislation in the EU, Japan, and the U.S., mandating a gradual shift  Read more...
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Crandall, Erika R.
Factors Governing Tin Whisker Growth.
Dordrecht : Springer, ©2013
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Erika R Crandall
ISBN: 9783319004709 3319004700 3319004697 9783319004693
OCLC Number: 862794298
Description: 1 online resource (145 pages).
Contents: Supervisor's Foreword; Acknowledgments; Contents; 1 Introduction: Whiskers and Their Role in Component Reliability; 1.1{u2026}What Are Whiskers?; 1.2{u2026}History of Whiskering; 1.3{u2026}Impact of the Lead-Free Movement; 1.4{u2026}Reported Sn Whisker Failures; 1.5{u2026}Literature Survey of Factors Influencing Whisker Growth; 1.6{u2026}Challenging Aspects of Whisker Studies; 1.7{u2026}Unique Features of the Investigative Plan; 1.7.1 Film/Substrate Effects; 1.7.2 Environmental Effects; References; 2 Film/Substrate Effects on Whisker Growth; 2.1{u2026}The Influence of Film Thickness on Sn Whiskering; 2.1.1 Ultra-Thin Film Whiskering. 2.1.2 Thicker Sn Film Whiskering2.2{u2026}Whisker Growth from Patterned Arrays of Deposited Sn; 2.3{u2026}A Spectacular Case: Whisker Growth from Sn on Ag Substrates; 2.4{u2026}Sn/Substrate Combinations Which Eliminate the Influence of Intermetallic Formation; 2.5{u2026}Whisker Growth Under Different Film Stress Conditions; 2.6{u2026}Whiskering from Sn Alloy Films; References; 3 Environmental Effects on Whisker Growth; 3.1{u2026}Effects of Oxygen Exposure on Sn Whiskering; 3.2{u2026}The Influence of Relative Humidity on Whiskering; 3.3{u2026}The Role of Sn Oxide Formation on Whisker Growth; 3.3.1 Wet Oxidation @ 120 degC. 3.3.2 Dry Oxidation3.3.3 Bulk, Polycrystalline Sn Dry Oxidation; 3.4{u2026}Is a Surface Sn Oxide Necessary for Whisker Growth?; 3.5{u2026}The Effect of Electrical Bias on Sn Whiskering; References; 4 Whisker Mitigation and Prevention; 4.1{u2026}Efficacy of POSS Conformal Coating to Block Whiskers; 4.2{u2026}Suppression of Sn Whiskering Using a Ni Under Layer; 4.3{u2026}Effectiveness of Hard Metal Cap Layers in Blocking Sn Whiskers; References; 5 Conclusions; 5.1{u2026}Summary of Results; 5.2{u2026}Continuing Studies; References; Curriculum Vitae.
Series Title: Springer theses.
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Abstract:

This book examines formation of whiskers on tin film surfaces, using reproducible laboratory-created whiskers under a variety of controlled environmental factors. Discusses how to impede or prevent  Read more...

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