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Failure Modes and Mechanisms in Electronic Packages

Author: Puligandla Viswanadham; Pratap Singh
Publisher: Boston, MA : Springer US, 1998.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Database:WorldCat
Summary:
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies.
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Puligandla Viswanadham; Pratap Singh
ISBN: 9781461560296 1461560292
OCLC Number: 851780601
Description: 1 online resource (xxi, 370 pages)
Contents: 1 Introduction --
1.1 The Technology --
1.2 Packaging Failure --
1.3 Approach and Methodology --
1.4 Packaging Hierarchy --
1.5 Failure Detection --
1.6 Analysis --
1.7 Modes and Mechanisms --
1.8 Physics of failure and statistical models --
1.9 Prevention --
1.10 The Future --
1.11 Suggested Readings --
2 Electronics Packaging --
2.1 Introduction --
2.2 Packaging Nomenclature --
2.3 Package Function --
2.4 Plated-Through-Hole and Surface Mount Technology --
2.5 Chip Level Packaging --
2.6 Printed Circuit Board Assembly --
2.7 Connectors, Cables, and Sockets --
2.8 Box Level Package --
2.9 Cost of Failures --
2.10 Summary --
2.11 Suggested Readings --
2.12 References --
3 Why Failures Occur --
3.1 Introduction --
3.2 Stress vs. Strength --
3.3 Poor Design Practices --
3.4 Manufacturing Defects --
3.5 Electrical Design Considerations --
3.6 Material Characteristics --
3.7 Summary --
3.8 References --
4 Failure Detection --
4.1 Introduction --
4.2 Analytical Modeling --
4.3 Simulation --
4.4 Environmental Stress Tests --
4.5 Test Methodology Innovations --
4.6 Summary --
4.7 Suggested Readings --
4.8 References --
5 Failure Analysis --
5.1 Introduction --
5.2 Visual Inspection --
5.3 Decapsulation --
5.4 Moiré Interferometry --
5.5 Dye Penetrants --
5.6 Metallurgical Analysis --
5.7 Chemical Analysis --
5.8 Atomic Absorption Emission Spectroscopies --
5.9 UV/Visible Spectroscopy --
5.10 Infrared Spectroscopy --
5.11 Thermoanalytical Methods --
5.12 Chromatography --
5.13 Electron Beam Analysis --
5.14 Laser Induced Ionization Mass Spectrometry (LIMS) --
5.15 Summary --
5.16 Suggested Readings --
5.17 References --
6 Failure Modes and Mechanisms --
6.1 Introduction --
6.2 Failure Mode Types --
6.3 Printed Circuit Board --
6.4 Components and Packages --
6.5 Interconnection Failures --
6.6 Lead-Free Solders --
6.7 Corrosion and Migration --
6.8 Connector Failures and Mechanisms --
6.9 Solder Fatigue and Creep --
6.10 Failures in Nonsemiconductor Components --
6.11 Electro Static Discharge (ESD) Failures --
6.12 PCB Laminates and Hollow Glass Fibers --
6.13 Radiation-Induced Failures --
6.14 Summary --
6.15 Suggested Readings --
6.16 References --
7 Failure Models --
7.1 Introduction --
7.2 A Survey of Physical Models --
7.3 Physics-of-Failure Based Models for Devices --
7.4 Accelerated Factors and Transforms --
7.5 Summary --
7.6 References --
8 Failure Prevention --
8.1 Introduction --
8.2 Concurrent Engineering and DFM --
8.3 DFM Examples --
8.4 Design for Assembly --
8.5 Design for Test --
8.6 Design for Qualification --
8.7 Design for Reliability --
8.8 Continuous Improvement Through Defect Management --
8.9 Summary --
8.10 References.
Responsibility: by Puligandla Viswanadham, Pratap Singh.
More information:

Abstract:

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies.

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