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Fatigue life prediction of solder joints in electronic packages with ANSYS

Author: Erdogan Madenci; Ibrahim Guven; Bahattin Kilic
Publisher: Boston, Mass. : Kluwer Academic Publishers, 2002.
Series: Kluwer international series in engineering and computer science, SECS 719.
Edition/Format:   Print book : EnglishView all editions and formats
Summary:

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) describes the method in great detail starting from the theoretical basis.

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Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: Erdogan Madenci; Ibrahim Guven; Bahattin Kilic
ISBN: 1402073305 9781402073304
OCLC Number: 50773318
Description: xx, 185 pages : illustrations ; 25 cm + 1 CD-ROM (4 3/4 in.).
Contents: Preface. List of Commands. List of Tables. List of Figures. 1: Introduction. 1.1. Numerical Modeling with Finite Element Analysis. 1.2. Constitutive Relations. 1.3. Failure Prediction. 1.4. References. 2: Thermomechanical Fatigue Life Prediction Analysis. 2.1. Approach. 2.2. Analysis Steps. 2.3. Case Study: BGA-Type Package. 2.4. References. 3: Mechanical Bending Fatigue Life Prediction Analysis. 3.1. Approach. 3.2. Analysis Steps. 3.3. Case Study: BGA-Type Package. 3.4. References. 4: Macro Reference Library. 4.1. Overview. 4.2. Preprocessor. 4.3. Solution. 4.4. Postprocessing. 4.5. References. Appendix A: Installation and Execution. A.1: Steps for ReliANS Installation on a PC Platform. A.2: Steps for Adding Working Directories for Use in ReliANS. A.3: Demonstration of ReliANS Installation and Adding New Directories. A.4: Installation of ReliANS on UNIX Systems. Appendix B: Input Listings for Case Studies. B.1: Input Listing for the Case Study Given in Chapter 2. B.2: Input Listing for the Case Study Given in Chapter 3. Index.
Series Title: Kluwer international series in engineering and computer science, SECS 719.
Responsibility: Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.
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From the reviews:"Fatigue Life Prediction of Solder Joints in Electronic Packages ... excites the interest of engineers and allows them to conduct fatigue reliability analysis of solder joints. ... Read more...

 
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