skip to content
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® Preview this item
ClosePreview this item
Checking...

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

Author: Erdogan Madenci; Ibrahim Guven; Bahattin Kilic
Publisher: Boston, MA : Springer US, 2003.
Series: International series in engineering and computer science, 719.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Summary:
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The  Read more...
Rating:

(not yet rated) 0 with reviews - Be the first.

Subjects
More like this

Find a copy online

Links to this item

Find a copy in the library

&AllPage.SpinnerRetrieving; Finding libraries that hold this item...

Details

Genre/Form: Electronic books
Additional Physical Format: Print version:
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Erdogan Madenci; Ibrahim Guven; Bahattin Kilic
ISBN: 9781461502555 1461502551
OCLC Number: 852792388
Description: 1 online resource (xx, 185 pages).
Contents: 1 Introduction --
1.1 Numerical Modeling with Finite Element Analysis --
1.2 Constitutive Relations --
1.3 Failure Prediction --
1.4 References --
2 Thermomechanical Fatigue Life Prediction Analysis --
2.1 Approach --
2.2 Analysis Steps --
2.3 Case Study: BGA-Type Package --
2.4 References --
3 Mechanical Bending Fatigue Life Prediction Analysis --
3.1 Approach --
3.2 Analysis Steps --
3.3 Case Study: BGA-Type Package --
3.4 References --
4 Macro Reference Library --
4.1 Overview --
4.2 Preprocessor --
4.3 Solution --
4.4 Postprocessing --
4.5 Reference --
Appendix A: Installation and Execution --
A.1 Steps for ReliANS Installation on a PC Platform --
A.2 Steps for Adding Working Directories for Use in ReliANS --
A.3 Demonstration of ReliANS Installation and Adding New Directories --
A.4 Installation of ReliANS on UNIX Systems --
Appendix B: Input Listings for Case Studies --
B. 1 Input Listing for the Case Study Given in Chapter 2 --
B.2 Input Listing for the Case Study Given in Chapter 3.
Series Title: International series in engineering and computer science, 719.
Responsibility: by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.

Abstract:

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS (R) describes the method in great detail starting from the theoretical basis.  Read more...

Reviews

Editorial reviews

Publisher Synopsis

From the reviews:"Fatigue Life Prediction of Solder Joints in Electronic Packages ... excites the interest of engineers and allows them to conduct fatigue reliability analysis of solder joints. ... Read more...

 
User-contributed reviews
Retrieving GoodReads reviews...
Retrieving DOGObooks reviews...

Tags

Be the first.
Confirm this request

You may have already requested this item. Please select Ok if you would like to proceed with this request anyway.

Linked Data


Primary Entity

<http://www.worldcat.org/oclc/852792388> # Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
    a schema:Book, schema:MediaObject, schema:CreativeWork ;
    library:oclcnum "852792388" ;
    library:placeOfPublication <http://id.loc.gov/vocabulary/countries/mau> ;
    library:placeOfPublication <http://experiment.worldcat.org/entity/work/data/757408#Place/boston_ma> ; # Boston, MA
    schema:about <http://id.worldcat.org/fast/1004959> ; # Machinery
    schema:about <http://dewey.info/class/670/e23/> ;
    schema:about <http://id.worldcat.org/fast/1046768> ; # Optical materials
    schema:about <http://id.worldcat.org/fast/872078> ; # Computer engineering
    schema:about <http://id.worldcat.org/fast/910312> ; # Engineering
    schema:bookFormat schema:EBook ;
    schema:contributor <http://viaf.org/viaf/9216483> ; # Ibrahim Guven
    schema:contributor <http://viaf.org/viaf/163870944> ; # Bahattin Kilic
    schema:creator <http://viaf.org/viaf/1839651> ; # Erdogan Madenci
    schema:datePublished "2003" ;
    schema:description "1 Introduction -- 1.1 Numerical Modeling with Finite Element Analysis -- 1.2 Constitutive Relations -- 1.3 Failure Prediction -- 1.4 References -- 2 Thermomechanical Fatigue Life Prediction Analysis -- 2.1 Approach -- 2.2 Analysis Steps -- 2.3 Case Study: BGA-Type Package -- 2.4 References -- 3 Mechanical Bending Fatigue Life Prediction Analysis -- 3.1 Approach -- 3.2 Analysis Steps -- 3.3 Case Study: BGA-Type Package -- 3.4 References -- 4 Macro Reference Library -- 4.1 Overview -- 4.2 Preprocessor -- 4.3 Solution -- 4.4 Postprocessing -- 4.5 Reference -- Appendix A: Installation and Execution -- A.1 Steps for ReliANS Installation on a PC Platform -- A.2 Steps for Adding Working Directories for Use in ReliANS -- A.3 Demonstration of ReliANS Installation and Adding New Directories -- A.4 Installation of ReliANS on UNIX Systems -- Appendix B: Input Listings for Case Studies -- B. 1 Input Listing for the Case Study Given in Chapter 2 -- B.2 Input Listing for the Case Study Given in Chapter 3."@en ;
    schema:description "Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages."@en ;
    schema:exampleOfWork <http://worldcat.org/entity/work/id/757408> ;
    schema:genre "Electronic books"@en ;
    schema:inLanguage "en" ;
    schema:isPartOf <http://experiment.worldcat.org/entity/work/data/757408#Series/international_series_in_engineering_and_computer_science> ; # International series in engineering and computer science ;
    schema:isPartOf <http://worldcat.org/issn/0893-3405> ; # The Springer International Series in Engineering and Computer Science,
    schema:isSimilarTo <http://worldcat.org/entity/work/data/757408#CreativeWork/> ;
    schema:name "Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®"@en ;
    schema:productID "852792388" ;
    schema:publication <http://www.worldcat.org/title/-/oclc/852792388#PublicationEvent/boston_ma_springer_us_2003> ;
    schema:publisher <http://experiment.worldcat.org/entity/work/data/757408#Agent/springer_us> ; # Springer US
    schema:url <http://dx.doi.org/10.1007/978-1-4615-0255-5> ;
    schema:url <http://public.eblib.com/choice/publicfullrecord.aspx?p=3079228> ;
    schema:workExample <http://dx.doi.org/10.1007/978-1-4615-0255-5> ;
    schema:workExample <http://worldcat.org/isbn/9781461502555> ;
    wdrs:describedby <http://www.worldcat.org/title/-/oclc/852792388> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/757408#Agent/springer_us> # Springer US
    a bgn:Agent ;
    schema:name "Springer US" ;
    .

<http://experiment.worldcat.org/entity/work/data/757408#Series/international_series_in_engineering_and_computer_science> # International series in engineering and computer science ;
    a bgn:PublicationSeries ;
    schema:hasPart <http://www.worldcat.org/oclc/852792388> ; # Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
    schema:name "International series in engineering and computer science ;" ;
    .

<http://id.worldcat.org/fast/1004959> # Machinery
    a schema:Intangible ;
    schema:name "Machinery"@en ;
    .

<http://id.worldcat.org/fast/1046768> # Optical materials
    a schema:Intangible ;
    schema:name "Optical materials"@en ;
    .

<http://id.worldcat.org/fast/872078> # Computer engineering
    a schema:Intangible ;
    schema:name "Computer engineering"@en ;
    .

<http://id.worldcat.org/fast/910312> # Engineering
    a schema:Intangible ;
    schema:name "Engineering"@en ;
    .

<http://viaf.org/viaf/163870944> # Bahattin Kilic
    a schema:Person ;
    schema:familyName "Kilic" ;
    schema:givenName "Bahattin" ;
    schema:name "Bahattin Kilic" ;
    .

<http://viaf.org/viaf/1839651> # Erdogan Madenci
    a schema:Person ;
    schema:familyName "Madenci" ;
    schema:givenName "Erdogan" ;
    schema:name "Erdogan Madenci" ;
    .

<http://viaf.org/viaf/9216483> # Ibrahim Guven
    a schema:Person ;
    schema:familyName "Guven" ;
    schema:givenName "Ibrahim" ;
    schema:name "Ibrahim Guven" ;
    .

<http://worldcat.org/entity/work/data/757408#CreativeWork/>
    a schema:CreativeWork ;
    schema:description "Print version:" ;
    schema:isSimilarTo <http://www.worldcat.org/oclc/852792388> ; # Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
    .

<http://worldcat.org/isbn/9781461502555>
    a schema:ProductModel ;
    schema:isbn "1461502551" ;
    schema:isbn "9781461502555" ;
    .

<http://worldcat.org/issn/0893-3405> # The Springer International Series in Engineering and Computer Science,
    a bgn:PublicationSeries ;
    schema:hasPart <http://www.worldcat.org/oclc/852792388> ; # Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
    schema:issn "0893-3405" ;
    schema:name "The Springer International Series in Engineering and Computer Science," ;
    .

<http://www.worldcat.org/title/-/oclc/852792388>
    a genont:InformationResource, genont:ContentTypeGenericResource ;
    schema:about <http://www.worldcat.org/oclc/852792388> ; # Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
    schema:dateModified "2018-06-29" ;
    void:inDataset <http://purl.oclc.org/dataset/WorldCat> ;
    .


Content-negotiable representations

Close Window

Please sign in to WorldCat 

Don't have an account? You can easily create a free account.