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Flat panel display manufacturing

Author: Jun Souk; Shinji Morozumi; Fang-Chen Luo; Ion Bita
Publisher: Hoboken, NJ : John Wiley & Sons, Inc., 2018. ©2018
Series: Wiley SID series in display technology.
Edition/Format:   eBook : Document : EnglishView all editions and formats
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Genre/Form: Electronic books
Additional Physical Format: Print version:
Flat panel display manufacturing
Hoboken, NJ : John Wiley & Sons, 2018
(DLC) 2018011295
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Jun Souk; Shinji Morozumi; Fang-Chen Luo; Ion Bita
ISBN: 9781119161363 1119161363 9781119161387 111916138X
OCLC Number: 1043050464
Description: 1 online resource.
Contents: Intro; Table of Contents; List of Contributors; Series Editor's Foreword; Preface; Chapter 1: Introduction; 1.1 Introduction; 1.2 Historic Review of TFT-LCD Manufacturing Technology Progress; 1.3 Analyzing the Success Factors in LCD Manufacturing; References; Chapter 2: TFT Array Process Architecture and Manufacturing Process Flow; 2.1 Introduction; 2.2 Material Properties and TFT Characteristics of a-Si, LTPS, and Metal Oxide TFTs; 2.3 a-Si TFT Array Process Architecture and Process Flow; 2.4 Poly-Si TFT Architecture and Fabrication; 2.5 Oxide Semiconductor TFT Architecture and Fabrication 2.6 TFT LCD Applications2.7 Development of SLS-Based System on Glass Display [1, 11, 14, 15]; References; Chapter 3: Color Filter Architecture, Materials, and Process Flow; 3.1 Introduction; 3.2 Structure and Role of the Color Filter; 3.3 Color Filter Manufacturing Process Flow; 3.4 New Color Filter Design; References; Chapter 4: Liquid Crystal Cell Process; 4.1 Introduction; 4.2 Liquid Crystal Cell Process; 4.3 Conclusions; Acknowledgments; References; Chapter 5: TFT-LCD Module and Package Process; 5.1 Introduction; 5.2 Driver IC Bonding: TAB and COG 5.3 Introduction to Large-Panel JI Process5.4 Introduction to Small-Panel JI Process; 5.5 LCD Module Assembly; 5.6 Aging; 5.7 Module in Backlight or Backlight in Module; References; Chapter 6: LCD Backlights; 6.1 Introduction; 6.2 LED Sources; 6.3 Light Guide Plate; 6.4 Optical Films; 6.5 Direct-Type BLU; 6.6 Summary; References; Chapter 7: TFT Backplane and Issues for OLED; 7.1 Introduction; 7.2 LTPS TFT Backplane for OLED Films; 7.3 Oxide Semiconductor TFT for OLED; 7.4 Best Backplane Solution for AMOLED; References; Chapter 8A: OLED Manufacturing Process for Mobile Application 8A.1 Introduction8A.2 Current Status of AMOLED for Mobile Display; 8A.3 Fine Metal Mask Technology (Shadow Mask Technology); 8A.4 Encapsulation Techniques for OLEDs; 8A.5 Flexible OLED technology; 8A.6 AMOLED Manufacturing Process; 8A.7 Summary; References; Chapter 8B: OLED Manufacturing Process for TV Application; 8B.1 Introduction; 8B.2 Fine Metal Mask (FMM); 8B.3 Manufacturing Process for White OLED and Color Filter Methods; References; Chapter 9: OLED Encapsulation Technology; 9.1 Introduction; 9.2 Principles Of Oled Encapsulation; 9.3 Classification Of Encapsulation Technologies 9.4 SummaryReferences; Chapter 10: Flexible OLED Manufacturing; 10.1 Introduction; 10.2 Critical Technologies in Flexible OLED Display; 10.3 Process Flow of F-OLED; 10.4 Foldable OLED; 10.5 Summary; References; Chapter 11A: Metal Lines and ITO PVD; 11A.1 Introduction; 11A.2 Metal Line Evolution in Past Years of TFT-LCD; 11A.3 Metallization for OLED Display; 11A.4 Transparent Electrode; References; Chapter 11B: Thin-Film PVD: Materials, Processes, and Equipment; 11B.1 Introduction; 11B.2 Sputtering Method; 11B.3 Evolution of Sputtering Equipment for FPD Devices
Series Title: Wiley SID series in display technology.
Responsibility: edited by Jun Souk, Shinji Morozumi, Fang-Chen Luo, Ion Bita.

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