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The growing need for risk analysis

Author: C C Lee; G L Huffman; Risk Reduction Engineering Laboratory (U.S.). Thermal Processes Section.
Publisher: Cincinnati, Ohio : U.S. Environmental Protection Agency, Office of Research and Development, Office of Environmental Engineering and Technology Demonstration, Risk Reduction Engineering Laboratory, Waste Minimization, Destruction, and Disposal Research Division, Thermal Destruction Branch, Thermal Processes Section, [1995]
Edition/Format:   Book   Microform : National government publication : Microfiche : English
Database:WorldCat
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Material Type: Government publication, National government publication
Document Type: Book
All Authors / Contributors: C C Lee; G L Huffman; Risk Reduction Engineering Laboratory (U.S.). Thermal Processes Section.
OCLC Number: 33205945
Notes: Distributed to depository libraries in microfiche.
Shipping list no.: 95-0701-M.
Reproduction Notes: Microfiche. [Washington, D.C.] : Supt. of Docs., U.S. G.P.O., [1995]. 1 microfiche.
Description: 1 volume
Responsibility: by C.C. Lee and G.L. Huffman.

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