skip to content
Handbook of multilevel metallization for integrated circuits : materials, technology, and applications Preview this item
ClosePreview this item
Checking...

Handbook of multilevel metallization for integrated circuits : materials, technology, and applications

Author: Syd R Wilson; Clarence J Tracy; John L Freeman
Publisher: Park Ridge, N.J. : Noyes Publications, ©1993.
Series: Materials science and process technology series., Electronic materials and process technology.
Edition/Format:   eBook : Document : EnglishView all editions and formats
Summary:
It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules.
Rating:

(not yet rated) 0 with reviews - Be the first.

Subjects
More like this

 

Find a copy in the library

&AllPage.SpinnerRetrieving; Finding libraries that hold this item...

Details

Genre/Form: Electronic books
Additional Physical Format: Print version:
Handbook of multilevel metallization for integrated circuits.
Park Ridge, N.J. : Noyes Publications, ©1993
(DLC) 93026689
Material Type: Document, Internet resource
Document Type: Internet Resource, Computer File
All Authors / Contributors: Syd R Wilson; Clarence J Tracy; John L Freeman
ISBN: 1591243645 9781591243649 9780815513407 0815513402 9780815517603 0815517602
OCLC Number: 50306867
Reproduction Notes: Electronic reproduction. [S.l.] : HathiTrust Digital Library, 2010. MiAaHDL
Description: 1 online resource (xxiii, 887 pages) : illustrations.
Details: Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.
Contents: 12. Electronic Packaging and Its Influences On Integrated Circuit Design and Processing / Harry K. Charles, Jr. and G. Donald Wagner --
13. Future Interconnect Systems / S. Simon Wong.
Series Title: Materials science and process technology series., Electronic materials and process technology.
Responsibility: edited by Syd R. Wilson and Clarence J. Tracy, John L. Freeman, Jr.
More information:

Abstract:

Offers a technical summary of the areas that make up a multilevel metal system. This book includes topics such as associated design, analysis, materials, and manufacturing. It is suitable as a  Read more...

Reviews

User-contributed reviews
Retrieving GoodReads reviews...
Retrieving DOGObooks reviews...

Tags

Be the first.
Confirm this request

You may have already requested this item. Please select Ok if you would like to proceed with this request anyway.

Linked Data


Primary Entity

<http://www.worldcat.org/oclc/50306867> # Handbook of multilevel metallization for integrated circuits : materials, technology, and applications
    a schema:Book, schema:CreativeWork, schema:MediaObject ;
    library:oclcnum "50306867" ;
    library:placeOfPublication <http://experiment.worldcat.org/entity/work/data/1106191091#Place/park_ridge_n_j> ; # Park Ridge, N.J.
    library:placeOfPublication <http://id.loc.gov/vocabulary/countries/nju> ;
    schema:about <http://id.worldcat.org/fast/975545> ; # Integrated circuits--Design and construction
    schema:about <http://experiment.worldcat.org/entity/work/data/1106191091#Topic/technology_&_engineering_electronics_circuits_general> ; # TECHNOLOGY & ENGINEERING--Electronics--Circuits--General
    schema:about <http://id.worldcat.org/fast/1017914> ; # Metallizing
    schema:about <http://experiment.worldcat.org/entity/work/data/1106191091#Topic/circuits_integres> ; # Circuits intégrés
    schema:about <http://dewey.info/class/621.3815/e22/> ;
    schema:about <http://experiment.worldcat.org/entity/work/data/1106191091#Topic/circuitos_integrados> ; # Circuitos integrados
    schema:about <http://experiment.worldcat.org/entity/work/data/1106191091#Topic/technology_&_engineering_electronics_circuits_integrated> ; # TECHNOLOGY & ENGINEERING--Electronics--Circuits--Integrated
    schema:about <http://id.loc.gov/authorities/subjects/sh85067118> ; # Integrated circuits--Design and construction
    schema:bookFormat schema:EBook ;
    schema:contributor <http://viaf.org/viaf/43513594> ; # Clarence J. Tracy
    schema:contributor <http://viaf.org/viaf/55825416> ; # John L. Freeman
    schema:contributor <http://viaf.org/viaf/13846009> ; # Syd R. Wilson
    schema:copyrightYear "1993" ;
    schema:datePublished "1993" ;
    schema:description "All important aspects of the fully integrated process are discussed in sufficient depth such that no additional literature searches are needed. (2) It serves as a reference text for any MLM engineer, new or experienced, who needs a refresher about the specifics of a concept or process. (3) For someone who wants to further specialize in one topical area, an extensive listing of references has been provided to simplify more in-depth study."@en ;
    schema:description "12. Electronic Packaging and Its Influences On Integrated Circuit Design and Processing / Harry K. Charles, Jr. and G. Donald Wagner -- 13. Future Interconnect Systems / S. Simon Wong."@en ;
    schema:description "It is widely recognized that the successful design, development, and integration of multilevel metallization (MLM) systems is and will continue to be key to current and future VLSI technologies. All major semiconductor companies have significant ongoing research teams focused in this area. These teams must view multilevel metallization as a system rather than a collection of isolated process modules."@en ;
    schema:description "The Handbook of Multilevel Metallization for Integrated Circuits answers this need by pulling together in one volume a thorough technical summary of each of the key areas that make up a multilevel metal system. Properly included are associated design, analysis, materials, and manufacturing topics. The book serves three purposes: (1) It is a good learning tool for the engineer newly assigned to work in metallization."@en ;
    schema:description "MLM teams are usually composed of unit process specialists and it is difficult for them to become generalists to solve the device, design, chemical, materials science, and analysis problems which are encountered. The engineers comprising these teams have been forced to accumulate and read large numbers of publications from each topical area to obtain a reasonably complete understanding of the numerous topics."@en ;
    schema:exampleOfWork <http://worldcat.org/entity/work/id/1106191091> ;
    schema:genre "Electronic books"@en ;
    schema:inLanguage "en" ;
    schema:isPartOf <http://experiment.worldcat.org/entity/work/data/1106191091#Series/materials_science_and_process_technology_series> ; # Materials science and process technology series.
    schema:isPartOf <http://experiment.worldcat.org/entity/work/data/1106191091#Series/materials_science_and_process_technology_series_electronic_materials_and_process_technology> ; # Materials science and process technology series. Electronic materials and process technology
    schema:isSimilarTo <http://worldcat.org/entity/work/data/1106191091#CreativeWork/handbook_of_multilevel_metallization_for_integrated_circuits> ;
    schema:name "Handbook of multilevel metallization for integrated circuits : materials, technology, and applications"@en ;
    schema:productID "50306867" ;
    schema:publication <http://www.worldcat.org/title/-/oclc/50306867#PublicationEvent/park_ridge_n_j_noyes_publications_1993> ;
    schema:publisher <http://experiment.worldcat.org/entity/work/data/1106191091#Agent/noyes_publications> ; # Noyes Publications
    schema:url <http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=254247> ;
    schema:url <https://app.knovel.com/web/toc.v/cid:kpHMMICMTB/viewerType:toc/root_slug:handbook-multilevel-metallization> ;
    schema:url <http://books.google.com/books?id=tHVTAAAAMAAJ> ;
    schema:url <http://www.myilibrary.com?id=200274> ;
    schema:url <http://app.knovel.com/knovel2/Toc.jsp?BookID=576> ;
    schema:url <http://app.knovel.com/web/toc.v/cid:kpHMMICMTB/viewerType:toc/root_slug:handbook-multilevel-metallization> ;
    schema:url <http://app.knovel.com/hotlink/toc/id:kpHMMICMTB/handbook-of-multilevel> ;
    schema:url <http://catalog.hathitrust.org/api/volumes/oclc/28422959.html> ;
    schema:url <http://site.ebrary.com/id/10265687> ;
    schema:workExample <http://worldcat.org/isbn/9781591243649> ;
    schema:workExample <http://worldcat.org/isbn/9780815517603> ;
    schema:workExample <http://worldcat.org/isbn/9780815513407> ;
    wdrs:describedby <http://www.worldcat.org/title/-/oclc/50306867> ;
    .


Related Entities

<http://experiment.worldcat.org/entity/work/data/1106191091#Agent/noyes_publications> # Noyes Publications
    a bgn:Agent ;
    schema:name "Noyes Publications" ;
    .

<http://experiment.worldcat.org/entity/work/data/1106191091#Place/park_ridge_n_j> # Park Ridge, N.J.
    a schema:Place ;
    schema:name "Park Ridge, N.J." ;
    .

<http://experiment.worldcat.org/entity/work/data/1106191091#Series/materials_science_and_process_technology_series> # Materials science and process technology series.
    a bgn:PublicationSeries ;
    schema:hasPart <http://www.worldcat.org/oclc/50306867> ; # Handbook of multilevel metallization for integrated circuits : materials, technology, and applications
    schema:name "Materials science and process technology series." ;
    .

<http://experiment.worldcat.org/entity/work/data/1106191091#Series/materials_science_and_process_technology_series_electronic_materials_and_process_technology> # Materials science and process technology series. Electronic materials and process technology
    a bgn:PublicationSeries ;
    schema:hasPart <http://www.worldcat.org/oclc/50306867> ; # Handbook of multilevel metallization for integrated circuits : materials, technology, and applications
    schema:name "Materials science and process technology series. Electronic materials and process technology" ;
    .

<http://experiment.worldcat.org/entity/work/data/1106191091#Topic/circuitos_integrados> # Circuitos integrados
    a schema:Intangible ;
    schema:name "Circuitos integrados"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/1106191091#Topic/circuits_integres> # Circuits intégrés
    a schema:Intangible ;
    schema:name "Circuits intégrés"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/1106191091#Topic/technology_&_engineering_electronics_circuits_general> # TECHNOLOGY & ENGINEERING--Electronics--Circuits--General
    a schema:Intangible ;
    schema:name "TECHNOLOGY & ENGINEERING--Electronics--Circuits--General"@en ;
    .

<http://experiment.worldcat.org/entity/work/data/1106191091#Topic/technology_&_engineering_electronics_circuits_integrated> # TECHNOLOGY & ENGINEERING--Electronics--Circuits--Integrated
    a schema:Intangible ;
    schema:name "TECHNOLOGY & ENGINEERING--Electronics--Circuits--Integrated"@en ;
    .

<http://id.loc.gov/authorities/subjects/sh85067118> # Integrated circuits--Design and construction
    a schema:Intangible ;
    schema:name "Integrated circuits--Design and construction"@en ;
    .

<http://id.worldcat.org/fast/1017914> # Metallizing
    a schema:Intangible ;
    schema:name "Metallizing"@en ;
    .

<http://id.worldcat.org/fast/975545> # Integrated circuits--Design and construction
    a schema:Intangible ;
    schema:name "Integrated circuits--Design and construction"@en ;
    .

<http://viaf.org/viaf/13846009> # Syd R. Wilson
    a schema:Person ;
    schema:familyName "Wilson" ;
    schema:givenName "Syd R." ;
    schema:name "Syd R. Wilson" ;
    .

<http://viaf.org/viaf/43513594> # Clarence J. Tracy
    a schema:Person ;
    schema:familyName "Tracy" ;
    schema:givenName "Clarence J." ;
    schema:name "Clarence J. Tracy" ;
    .

<http://viaf.org/viaf/55825416> # John L. Freeman
    a schema:Person ;
    schema:familyName "Freeman" ;
    schema:givenName "John L." ;
    schema:name "John L. Freeman" ;
    .

<http://worldcat.org/entity/work/data/1106191091#CreativeWork/handbook_of_multilevel_metallization_for_integrated_circuits>
    a schema:CreativeWork ;
    rdfs:label "Handbook of multilevel metallization for integrated circuits." ;
    schema:description "Print version:" ;
    schema:isSimilarTo <http://www.worldcat.org/oclc/50306867> ; # Handbook of multilevel metallization for integrated circuits : materials, technology, and applications
    .

<http://worldcat.org/isbn/9780815513407>
    a schema:ProductModel ;
    schema:isbn "0815513402" ;
    schema:isbn "9780815513407" ;
    .

<http://worldcat.org/isbn/9780815517603>
    a schema:ProductModel ;
    schema:isbn "0815517602" ;
    schema:isbn "9780815517603" ;
    .

<http://worldcat.org/isbn/9781591243649>
    a schema:ProductModel ;
    schema:isbn "1591243645" ;
    schema:isbn "9781591243649" ;
    .

<http://www.worldcat.org/title/-/oclc/50306867>
    a genont:InformationResource, genont:ContentTypeGenericResource ;
    schema:about <http://www.worldcat.org/oclc/50306867> ; # Handbook of multilevel metallization for integrated circuits : materials, technology, and applications
    schema:dateModified "2018-02-09" ;
    void:inDataset <http://purl.oclc.org/dataset/WorldCat> ;
    .


Content-negotiable representations

Close Window

Please sign in to WorldCat 

Don't have an account? You can easily create a free account.