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Handbook of radiation effects

Author: A G Holmes-Siedle; Len Adams
Publisher: Oxford ; New York : Oxford University Press, 2001.
Edition/Format:   Book : English : 2nd edView all editions and formats
Database:WorldCat
Summary:

Suitable for engineer-designers and other professionals, this practical handbook describes the relationship between high-energy radiation environments, electronic device physics and materials. It  Read more...

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Genre/Form: Handbooks, manuals, etc
Material Type: Internet resource
Document Type: Book, Internet Resource
All Authors / Contributors: A G Holmes-Siedle; Len Adams
ISBN: 019850733X 9780198507338
OCLC Number: 47930537
Description: xxv, 614 p. : ill. ; 24 cm.
Contents: 1. Radiation, physics and measurement ; 2. Radiation environments (including human risks from the terrestrial environment) ; 3. Response of materials and devices to radiation ; 4. Metal-oxide-semiconductor (MOS) devices ; 5. Bipolar transistors and integrated circuits ; 6. Diodes, solar cells, optoelectronics ; 7. Power semiconductors ; 8. Optical media ; 9. Microelectronics, sensors, MEMs, passives, and other components ; 10. Polymers and other organics ; 11. The interaction of radiation with shielding materials ; 12. Computer methods for particle transport ; 13. Radiation testing ; 14. Radiation-hardening of semiconductor parts ; 15. Equipment hardening and hardness assurance ; APPENDICES ; A. Useful general and geophysical data ; B. Radiation quantities ; C. Useful data on materials used in electronic equipment ; D. Bibliography of dosimeter research ; E. Dose-depth curves for typical Earth orbits, calculated by ESA's Space Environment Information System (SPENVIS) software ; F. Degradation in polymers in ionizing radiation ; G. Useful websites
Other Titles: Radiation effects
Responsibility: Andrew Holmes-Siedle and Len Adams.
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... contains a lot of valuable material and is not only a handbook, but also an excellent textbook. CERN Courier ... enriched with many references to useful websites, including databases. CERN Read more...

 
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